Abstract: A composition for curable films, a curable film made thereof, and a cured product obtained by curing the curable film are disclosed. The curable film contains fused silica and/or hollow glass microspheres, a rubber composition containing at least one diene-based rubber, and a toluene soluble maleimide resin. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.

Abstract: A curable film and a cured product obtained by curing the curable film are disclosed. The curable film contains, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.

Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.

Abstract: This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein R1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); R1b is optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); each occurrence of R2 and R3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R2 and R3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q1? and Q2? is independently a counterion (e.g., each of Q1? and Q2? is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g.

Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.

Abstract: Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.

Abstract: The present invention relates to the reduction of polycyano compounds to produce polyamines, in particular diaminoacetal and diaminoketal compounds, and their use as curing agents in epoxy resin compositions. The reduction with molecular hydrogen can be carried out using a metal catalyst selected from GROUP VIII and a catalytic promoter. The reduction can include anhydrous or aqueous ammonia. The reaction can be carried out in continuous and batch modes with catalyst and solvent recycling. The epoxy resin composition consisting of an epoxy resin and a polyamine curing agent that can be used in fiber-reinforced composite materials, coating materials, and the like.

Abstract: Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Abstract: This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein R1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); R1b is optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); each occurrence of R2 and R3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R2 and R3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q1? and Q2? is independently a counterion (e.g., each of Q1? and Q2? is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g.

Abstract: This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein R1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); R1b is optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); each occurrence of R2 and R3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R2 and R3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q1? and Q2? is independently a counterion (e.g., each of Q1? and Q2? is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g.

Abstract: Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

Abstract: The present invention relates to the reduction of polycyano compounds to produce polyamines, in particular diaminoacetal and diaminoketal compounds, and their use as curing agents in epoxy resin compositions. The reduction with molecular hydrogen can be carried out using a metal catalyst selected from GROUP VIII and a catalytic promoter. The reduction can include anhydrous or aqueous ammonia. The reaction can be carried out in continuous and batch modes with catalyst and solvent recycling. The epoxy resin composition consisting of an epoxy resin and a polyamine curing agent that can be used in fiber-reinforced composite materials, coating materials, and the like.

Abstract: The present invention relates to the reduction of polycyano compounds to produce polyamines, in particular diaminoacetal and diaminoketal compounds, and their use as curing agents in epoxy resin compositions. The reduction with molecular hydrogen can be carried out using a metal catalyst selected from GROUP VIII and a catalytic promoter. The reduction can include anhydrous or aqueous ammonia. The reaction can be carried out in continuous and batch modes with catalyst and solvent recycling. The epoxy resin composition consisting of an epoxy resin and a polyamine curing agent that can be used in fiber-reinforced composite materials, coating materials, and the like.

Abstract: The present invention relates to the reduction of polycyano compounds to produce polyamines, in particular diaminoacetal and diaminoketal compounds, and their use as curing agents in epoxy resin compositions. The reduction with molecular hydrogen can be carried out using a metal catalyst selected from GROUP VIII and a catalytic promoter. The reduction can include anhydrous or aqueous ammonia. The reaction can be carried out in continuous and batch modes with catalyst and solvent recycling. The epoxy resin composition consisting of an epoxy resin and a polyamine curing agent that can be used in fiber-reinforced composite materials, coating materials, and the like.

Abstract: This application relates, in part, to novel salts represented by the following structure of Formula (1): wherein R1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); R1b is optionally substituted alkyl (e.g., unsubstituted C1-6 alkyl, e.g., —CH3); each occurrence of R2 and R3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R2 and R3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q1? and Q2? is independently a counterion (e.g., each of Q1? and Q2? is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g.

Abstract: Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.