Abstract: A monolithically integrated microwave guide component for overcoupling high frequencies includes a first micro-waveguide that is structured on a micro-waveguide chip, and comprises a second micro-waveguide that is structured on a carrier substrate. The microwave guides are contacted to one another by a chip through-plating. The microwave guides each include, in the contact region, an integrated compensating structure that serves to compensate for reflections.

Abstract: A balancing network has three planar lines which are coupled together. One end of the first line which runs between the second and the third line acts as an unbalanced gate. The opposite end of the first line is connected to earth, and one end of each of the other two lines forms a balanced gate. The balancing network is decoupled from the direct current source. The ends of the second and third lines, which do not act as gates, are capacitively coupled with one another.

Abstract: The invention relates to an integrated semiconductor mixer, having a substrate (10), a radio-frequency balun (12) disposed on the substrate (10), a local oscillator balun (14) disposed on the substrate (10), an intermediate-frequency port (16) disposed on the substrate (10), and a mixer diode array (18), disposed on the substrate (10), that communicates with the radio-frequency balun (12), the local oscillator balun (14), and the intermediate-frequency port (16), in which the radio-frequency balun (12) is shielded from the local oscillator balun (14) by plated holes (20).

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.

Abstract: On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the pads. In use, the board is populated with CWL bonds (this includes the normal circuit-related RF bond-pads as well as the test bond-pads) and the test bonds are distorted so that the bond-wires in question lie aligned against the markings. The alignment position relative to the markings indicates whether the bond-wires for the whole board are of correct or incorrect length. Measurement may be either absolute, in which case the markings are associated with a scale indication, or relative, in which case one of the markings will usually be visibly distinguished from the rest in some way. Depending on the length determination, the bond-forming device (e.g.