Abstract: A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.

Abstract: The invention relates to a chip (1) for use in an operating device for lighting means, wherein the chip (1) is designed to control a processing block (2) of an operating device for lighting means, wherein the chip (1) can control a plurality of different processing blocks (2) which differ in their function, wherein the chip (1) is designed to select on the basis of at least one signal applied to the chip (1) what type of processing block (2) should be controlled.

Abstract: The invention relates to a chip (1) for use in an operating device for lighting means, wherein the chip (1) is designed to control a processing block (2) of an operating device for lighting means, wherein the chip (1) can control a plurality of different processing blocks (2) which differ in their function, wherein the chip (1) is designed to select on the basis of at least one signal applied to the chip (1) what type of processing block (2) should be controlled.

Abstract: A luminaire locating device may be used to automatically determine positions of luminaires of a lighting system. The luminaire locating device may have an interface to receive intensity information captured by a plurality of optical sensors. The luminaire locating device may have an electronic processing device to process the intensity information captured by the plurality of optical sensors to determine the positions of the luminaires.