Patents by Inventor Stefan KRAMP

Stefan KRAMP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10636754
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, a semiconductor chip includes a chip front side, a first chip pad located on the chip front side, a second chip pad located on the chip front side and an electrically insulating material located between the first chip pad and the second chip pad, wherein the first chip pad includes a surface layer predominantly comprising copper and the second chip pad includes a surface layer predominantly comprising aluminum.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 28, 2020
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kramp, Marco Koitz
  • Publication number: 20190362973
    Abstract: A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a chemical cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 28, 2019
    Inventors: Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler, Stefan Woehlert
  • Publication number: 20190311966
    Abstract: A semiconductor device includes a contact metallization layer arranged on a semiconductor substrate, an inorganic passivation structure arranged on the semiconductor substrate, and an organic passivation layer. The organic passivation layer is located between the contact metallization layer and the inorganic passivation structure, and located vertically closer to the semiconductor substrate than a part of the organic passivation layer located on top of the inorganic passivation structure.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 10, 2019
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse, Jochen Hilsenbeck, Ravi Keshav Joshi, Stefan Kramp, Stefan Krivec, Grzegorz Lupina, Hiroshi Narahashi, Andreas Voerckel, Stefan Woehlert
  • Patent number: 10418319
    Abstract: A method of manufacturing a semiconductor device includes providing an electrically conductive carrier and placing a semiconductor chip over the carrier. The method includes applying an electrically insulating layer over the carrier and the semiconductor chip. The electrically insulating layer has a first face facing the carrier and a second face opposite to the first face. The method includes selectively removing the electrically insulating layer and applying solder material where the electrically insulating layer is removed and on the second face of the electrically insulating layer.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: September 17, 2019
    Assignee: Infineon Technologies AG
    Inventors: Oliver Haeberlen, Klaus Schiess, Stefan Kramp
  • Publication number: 20190189574
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, a semiconductor chip includes a chip front side, a first chip pad located on the chip front side, a second chip pad located on the chip front side and an electrically insulating material located between the first chip pad and the second chip pad, wherein the first chip pad includes a surface layer predominantly comprising copper and the second chip pad includes a surface layer predominantly comprising aluminum.
    Type: Application
    Filed: January 30, 2019
    Publication date: June 20, 2019
    Inventors: Stefan Kramp, Marco Koitz
  • Patent number: 10236265
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, the method comprises depositing a barrier layer over a chip front side, depositing a copper layer after depositing the barrier layer, and removing a part of the copper layer located outside a first chip pad region, wherein a remaining portion of the copper layer within the first chip pad region forms a surface layer of the chip pad. The method further comprises removing a part of the barrier layer located outside the first chip pad region.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: March 19, 2019
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kramp, Marco Koitz
  • Patent number: 10018667
    Abstract: A method for testing semiconductor dies includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a first semiconductor die of the plurality of semiconductor dies by electrically connecting the test apparatus with the first contact element of the first semiconductor die and the contact location.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: July 10, 2018
    Assignee: Infineon Technologies AG
    Inventors: Erwin Thalmann, Michael Leutschacher, Christian Musshoff, Stefan Kramp
  • Patent number: 9905685
    Abstract: A semiconductor device includes compensation structures that extend from a first surface into a semiconductor portion. Sections of the semiconductor portion between neighboring ones of the compensation structures form semiconductor mesas. A field dielectric separating a field electrode in the compensation structures from the semiconductor portion includes a thermally grown portion, which directly adjoins the semiconductor portion. A not fully densified deposited portion of the field dielectric has a lower density than the thermally grown portion.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: February 27, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Ralf Siemieniec, Oliver Blank, Mario Kleindienst, Stefan Kramp
  • Patent number: 9786620
    Abstract: According to various embodiments, a semiconductor device may include: at least one first contact pad on a front side of the semiconductor device; at least one second contact pad on the front side of the semiconductor device; a layer stack disposed at least partially over the at least one first contact pad, wherein the at least one second contact pad is at least partially free of the layer stack; wherein the layer stack includes at least an adhesion layer and a metallization layer; and wherein the metallization layer includes a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: October 10, 2017
    Assignee: INFINEON TECHNOLGIES AG
    Inventor: Stefan Kramp
  • Publication number: 20170033067
    Abstract: According to various embodiments, a semiconductor device may include: at least one first contact pad on a front side of the semiconductor device; at least one second contact pad on the front side of the semiconductor device; a layer stack disposed at least partially over the at least one first contact pad, wherein the at least one second contact pad is at least partially free of the layer stack; wherein the layer stack includes at least an adhesion layer and a metallization layer; and wherein the metallization layer includes a metal alloy and wherein the adhesion layer is disposed between the metallization layer and the at least one first contact pad for adhering the metal alloy of the metallization layer to the at least one first contact pad.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 2, 2017
    Inventor: Stefan Kramp
  • Publication number: 20160356839
    Abstract: A method for testing semiconductor dies includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a first semiconductor die of the plurality of semiconductor dies by electrically connecting the test apparatus with the first contact element of the first semiconductor die and the contact location.
    Type: Application
    Filed: August 17, 2016
    Publication date: December 8, 2016
    Inventors: Erwin Thalmann, Michael Leutschacher, Christian Musshoff, Stefan Kramp
  • Publication number: 20160322489
    Abstract: A semiconductor device includes compensation structures that extend from a first surface into a semiconductor portion. Sections of the semiconductor portion between neighboring ones of the compensation structures form semiconductor mesas. A field dielectric separating a field electrode in the compensation structures from the semiconductor portion includes a thermally grown portion, which directly adjoins the semiconductor portion. A not fully densified deposited portion of the field dielectric has a lower density than the thermally grown portion.
    Type: Application
    Filed: April 27, 2016
    Publication date: November 3, 2016
    Inventors: RALF SIEMIENIEC, OLIVER BLANK, MARIO KLEINDIENST, STEFAN KRAMP
  • Patent number: 9435849
    Abstract: A method includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a semiconductor die by electrically connecting the test apparatus with the first contact element of the semiconductor die and the contact location.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: September 6, 2016
    Assignee: Infineon Technologies AG
    Inventors: Erwin Thalmann, Michael Leutschacher, Christian Musshoff, Stefan Kramp
  • Publication number: 20160027746
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, the method comprises depositing a barrier layer over a chip front side, depositing a copper layer after depositing the barrier layer, and removing a part of the copper layer located outside a first chip pad region, wherein a remaining portion of the copper layer within the first chip pad region forms a surface layer of the chip pad. The method further comprises removing a part of the barrier layer located outside the first chip pad region.
    Type: Application
    Filed: July 28, 2014
    Publication date: January 28, 2016
    Inventors: Stefan Kramp, Marco Koitz
  • Publication number: 20150377954
    Abstract: A method includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a semiconductor die by electrically connecting the test apparatus with the first contact element of the semiconductor die and the contact location.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Erwin Thalmann, Michael Leutschacher, Christian Musshoff, Stefan Kramp
  • Publication number: 20130252382
    Abstract: A method of manufacturing a semiconductor device includes providing an electrically conductive carrier and placing a semiconductor chip over the carrier. The method includes applying an electrically insulating layer over the carrier and the semiconductor chip. The electrically insulating layer has a first face facing the carrier and a second face opposite to the first face. The method includes selectively removing the electrically insulating layer and applying solder material where the electrically insulating layer is removed and on the second face of the electrically insulating layer.
    Type: Application
    Filed: May 14, 2013
    Publication date: September 26, 2013
    Inventors: Oliver Haeberlen, Klaus Schiess, Stefan Kramp
  • Patent number: 8441804
    Abstract: A semiconductor device and method of manufacturing a semiconductor device. One embodiment provides an electrically conductive carrier. A semiconductor chip is placed over the carrier. An electrically insulating layer is applied over the carrier and the semiconductor chip. The electrically insulating layer has a first face facing the carrier and a second face opposite to the first face. A first through-hole is in the electrically insulating layer. Solder material is deposited in the first through-hole and on the second face of the electrically insulating layer.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: May 14, 2013
    Assignee: Infineon Technologies AG
    Inventors: Oliver Haeberlen, Klaus Schiess, Stefan Kramp
  • Publication number: 20100019381
    Abstract: A semiconductor device and method of manufacturing a semiconductor device. One embodiment provides an electrically conductive carrier. A semiconductor chip is placed over the carrier. An electrically insulating layer is applied over the carrier and the semiconductor chip. The electrically insulating layer has a first face facing the carrier and a second face opposite to the first face. A first through-hole is in the electrically insulating layer. Solder material is deposited in the first through-hole and on the second face of the electrically insulating layer.
    Type: Application
    Filed: July 25, 2008
    Publication date: January 28, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Oliver Haeberlen, Klaus Schiess, Stefan Kramp
  • Publication number: 20090230519
    Abstract: This application relates to a semiconductor device comprising: a carrier comprising a chip island and at least one first external contact element; only one semiconductor chip, wherein the semiconductor chip comprises a first electrode on a first surface and a second electrode on a second surface opposite to the first surface and wherein the first electrode is attached to the chip island; and a metal structure comprising a plate region attached to the second electrode and a connection region attached to the at least one first external contact element, wherein the plate region extends laterally beyond the edges of at least two sides of the second surface of the semiconductor chip.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 17, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf OTREMBA, Wei Kee CHAN, Stanley JOB DORAISAMY, Stefan KRAMP, Fong LIM, Xaver SCHLOEGEL