Patents by Inventor Stefan Kreissig
Stefan Kreissig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11598789Abstract: Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis.Type: GrantFiled: October 20, 2021Date of Patent: March 7, 2023Assignee: FormFactor, Inc.Inventors: Martin Schindler, Stefan Kreissig, Torsten Kiel
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Publication number: 20220236303Abstract: Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis.Type: ApplicationFiled: October 20, 2021Publication date: July 28, 2022Inventors: Martin Schindler, Stefan Kreissig, Torsten Kiel
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Patent number: 8402848Abstract: A probe holder has a manipulator, a probe arm arranged on the manipulator, and a probe needle that is at least indirectly connected to the probe arm. To increase the number of contacts of a substrate to be tested and to make it possible to test a plurality of contacts in etched trenches of semiconductor elements in a group of wafers, the probe arm is connected to a needle support on which the probe needle and at least one second probe needle are arranged.Type: GrantFiled: October 10, 2008Date of Patent: March 26, 2013Assignee: Cascade Microtech, Inc.Inventors: Joerg Kiesewetter, Stojan Kanev, Stefan Kreissig
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Patent number: 8278951Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.Type: GrantFiled: November 15, 2007Date of Patent: October 2, 2012Assignee: Cascade Microtech, Inc.Inventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
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Publication number: 20100294053Abstract: A probe holder has a manipulator, a probe arm arranged on the manipulator, and a probe needle that is at least indirectly connected to the probe arm. To increase the number of contacts of a substrate to be tested and to make it possible to test a plurality of contacts in etched trenches of semiconductor elements in a group of wafers, the probe arm is connected to a needle support on which the probe needle and at least one second probe needle are arranged.Type: ApplicationFiled: October 10, 2008Publication date: November 25, 2010Applicant: SUSS MICROTEC TEST SYSTEMS GMBHInventors: Joerg Kiesewetter, Stojan Kanev, Stefan Kreissig
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Patent number: 7741860Abstract: A prober for testing components comprises a lower frame, over which a probe holder plate is disposed at a distance therefrom for receiving test probes that make contact with the components to be tested and to which a displacement device is connected. A substrate carrier is disposed in the space between the frame and the probe holder plate, and the probe holder plate is provided with an opening, below which the substrate carrier can be displaced. To expand the scope of application of probers used for testing components, all those components of the prober that surround the substrate are made from a non-magnetic material.Type: GrantFiled: June 24, 2008Date of Patent: June 22, 2010Assignee: SUSS MicroTec Test Systems GmbHInventors: Sebastian Giessmann, Stefan Kreissig, Stojan Kanev
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Patent number: 7671615Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.Type: GrantFiled: August 16, 2007Date of Patent: March 2, 2010Assignee: SUSS MicroTec Tech Systems GmbHInventors: Carel van de Beek, Stefan Kreissig, Volker Hansel, Sebastian Giessmann, Frank-Michael Werner, Claus Dietrich, Jorg Kiesewetter
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Patent number: 7652491Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.Type: GrantFiled: November 15, 2007Date of Patent: January 26, 2010Assignee: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
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Patent number: 7579854Abstract: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.Type: GrantFiled: November 21, 2007Date of Patent: August 25, 2009Assignee: SUSS MicroTec Test Systems GmbHInventors: Jörg Kiesewetter, Stefan Kreissig, Stojan Kanev, Claus Dietrich
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Patent number: 7579849Abstract: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.Type: GrantFiled: February 13, 2007Date of Patent: August 25, 2009Assignee: SUSS MicroTec Test Systems GmbHInventors: Jorg Kiesewetter, Stefan Kreissig, Stojan Kanev
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Publication number: 20090085595Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.Type: ApplicationFiled: December 8, 2008Publication date: April 2, 2009Applicant: SUSS MICROTEC TEST SYSTEMS GMBHInventors: Stojan KANEV, Hans-Jurgen FLEISCHER, Stefan KREISSIG, Jorg KIESEWETTER
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Publication number: 20090058442Abstract: A prober for testing components comprises a lower frame, over which a probe holder plate is disposed at a distance therefrom for receiving test probes that make contact with the components to be tested and to which a displacement device is connected. A substrate carrier is disposed in the space between the frame and the probe holder plate, and the probe holder plate is provided with an opening, below which the substrate carrier can be displaced. To expand the scope of application of probers used for testing components, all those components of the prober that surround the substrate are made from a non-magnetic material.Type: ApplicationFiled: June 24, 2008Publication date: March 5, 2009Applicant: SUSS MicroTec Test Systems GmbHInventors: Sebastian GIESSMANN, Stefan KREISSIG, Stojan KANEV
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Publication number: 20090049944Abstract: A micromanipulator for moving a probe comprises two elements which are mechanically connected to one another in such a way that one element can be moved relative to other element. The movement of the element occurs as a result of the pressure change of a fluid which acts upon an actuator which is in mechanical contact to a mobile element or to an element moving on a surface segment.Type: ApplicationFiled: January 30, 2008Publication date: February 26, 2009Applicant: SUSS MicroTec Test Systems GmbHInventors: Jorg Kiesewetter, Stojan Kanev, Lutz Junker, Stefan Kreissig
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Publication number: 20090021275Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.Type: ApplicationFiled: November 29, 2007Publication date: January 22, 2009Applicant: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Jorg Kiesewetter
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Patent number: 7463044Abstract: An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is in mechanical contact with and mobile relative to the base element. The location surface can be positioned relative to the base, in at least one positioning direction, by the positioning element which includes a gearing for converting rotary movement to translational movement in the positioning direction.Type: GrantFiled: September 12, 2006Date of Patent: December 9, 2008Assignee: SUSS Microtec Test Systems GmbHInventors: Steffen Schott, Stefan Kreissig, Axel Becker, Dietmar Runge
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Publication number: 20080143365Abstract: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.Type: ApplicationFiled: November 21, 2007Publication date: June 19, 2008Applicant: SUSS Micro Tec Test Systems GmbHInventors: Jorg Kiesewetter, Stefan Kreissig, Stojan Kanev, Claus Dietrich
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Publication number: 20080122468Abstract: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.Type: ApplicationFiled: February 13, 2007Publication date: May 29, 2008Applicant: SUSS MICROTEC TEST SYSTEMS GMBHInventors: Jorg KIESEWETTER, Stefan KREISSIG, Stojan KANEV
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Publication number: 20080116917Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes is specified. A process for testing test substrates in such a prober is also specified. The probe support comprises a probe card holder, a probe card, and a probe card adapter, where the probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed in such a manner that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from it.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Applicant: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Jurgen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
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Publication number: 20080116918Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Applicant: SUSS MicroTec Test Systems GmbHInventors: Stojan Kanev, Hans-Juergen Fleischer, Stefan Kreissig, Karsten Stoll, Axel Schmidt, Andreas Kittlaus
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Publication number: 20080042679Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.Type: ApplicationFiled: August 16, 2007Publication date: February 21, 2008Applicant: SUSS MicroTec Test Systems GmbHInventors: Carel van de Beek, Stefan Kreissig, Volker Hansel, Sebastian Giessmann, Frank-Michael Werner, Claus Dietrich, Jorg Kiesewetter