Patents by Inventor Stefan Nerreter

Stefan Nerreter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11564310
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 24, 2023
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Patent number: 11289425
    Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 29, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Patent number: 11212918
    Abstract: Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: December 28, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Patent number: 11169336
    Abstract: Various embodiments include an electro-optical circuit with an optical transmission path comprising: an electro-optical assembly having an optical transmitter element and/or an optical receiver element mounted on a mounting surface of a carrier component; a circuit carrier with a mounting side and an embedded optical waveguide exposed with an end face in a cutout in the mounting side; and an optical interface between the electro-optical assembly and the optical waveguide. The optical transmitter element and/or the optical receiver element is mounted on the carrier component with an alignment of its respective optical axis parallel to the mounting surface. The optical assembly is mounted on the circuit carrier with the mounting surface facing toward the mounting side. The optical transmitter element and/or the optical receiver element projects into the cutout and forms an optical axis with the exposed optical waveguide.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 9, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Stefan Nerreter
  • Publication number: 20210161002
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Application
    Filed: March 20, 2019
    Publication date: May 27, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20210132307
    Abstract: Various embodiments include an electro-optical circuit with an optical transmission path comprising: an electro-optical assembly having an optical transmitter element and/or an optical receiver element mounted on a mounting surface of a carrier component; a circuit carrier with a mounting side and an embedded optical waveguide exposed with an end face in a cutout in the mounting side; and an optical interface between the electro-optical assembly and the optical waveguide. The optical transmitter element and/or the optical receiver element is mounted on the carrier component with an alignment of its respective optical axis parallel to the mounting surface. The optical assembly is mounted on the circuit carrier with the mounting surface facing toward the mounting side. The optical transmitter element and/or the optical receiver element projects into the cutout and forms an optical axis with the exposed optical waveguide.
    Type: Application
    Filed: February 13, 2018
    Publication date: May 6, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventor: Stefan Nerreter
  • Patent number: 10902305
    Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: January 26, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
  • Publication number: 20210021179
    Abstract: A circuit arrangement is disclosed herein. The circuit arrangement includes a circuit carrier board, a power semiconductor arranged on the underside of the circuit carrier board, and a wiring carrier board arranged underneath the power semiconductor. The circuit arrangement further includes a metallic first spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor flows, wherein the first spacer element acts as a shunt through which current flows. The circuit arrangement further includes a voltage measuring unit, by which a voltage drop across the first spacer element, produced by the load current flow, may be determined. A converter having such a circuit arrangement, an aircraft having a converter, and a method for current measurement in power semiconductors are likewise specified.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 21, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20200170111
    Abstract: Various embodiments include an electrical assembly comprising: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
    Type: Application
    Filed: June 19, 2018
    Publication date: May 28, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Publication number: 20200161246
    Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.
    Type: Application
    Filed: July 3, 2018
    Publication date: May 21, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Publication number: 20200152532
    Abstract: Various embodiments include an electronic assembly comprising: a first substrate; a second substrate; and a component located between the first substrate and the second substrate. The component is in contact with the first substrate and the second substrate. A gap between the first substrate and the component is bridged with an auxiliary joining material. The first substrate defines a through-hole opening into the gap and sealed by the auxiliary joining material. The first substrate and the second substrate define a cavity closed against the environment.
    Type: Application
    Filed: April 20, 2018
    Publication date: May 14, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke
  • Publication number: 20200122450
    Abstract: A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.
    Type: Application
    Filed: June 7, 2018
    Publication date: April 23, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rene BLANK, Martin FRANKE, Peter FRUEHAUF, Ruediger KNOFE, Bernd MUELLER, Stefan NERRETER, Joerg STROGIES, Klaus WILKE
  • Patent number: 10582642
    Abstract: Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: March 3, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Publication number: 20190286958
    Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.
    Type: Application
    Filed: May 12, 2017
    Publication date: September 19, 2019
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
  • Publication number: 20180269371
    Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 20, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Publication number: 20180235101
    Abstract: The present disclosure relates to electronics. The teachings thereof may be embodied in cooling members for electronic components and/or methods for producing cooling members with an assembly side for an electronic component. For example, a cooling member may include: an assembly side for mounting an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels with a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Application
    Filed: July 8, 2016
    Publication date: August 16, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin FRANKE, Peter FRÜHAUF, Rüdiger KNOFE, Bernd MÜLLER, Stefan NERRETER, Michael NIEDERMAYER, Ulrich WITTREICH, Manfred ZÄSKE
  • Patent number: 9171488
    Abstract: A display element and a display device in which the display element is mounted. The display may be a variable message sign. The sign includes a tube-like housing in which lenses and apertures can be disposed. The light exiting a light source is emitted via an emitting surface, by way of which an illuminated traffic sign results from interacting with further display elements. The light source and the optical elements are disposed at different heights in the horizontally oriented housing. The optical axes can thereby extend horizontally, or the optical elements can lie on a main axis which is tilted downward in an radiation direction. In both cases, sunlight impinging from above at an angle advantageously falls on the LED to a slight degree, by way of which the phantom light phenomenon is minimized.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: October 27, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Axel Beier, Martin Franke, Stefan Nerreter, Volker Türck
  • Patent number: 8435191
    Abstract: The embodiments relate to a sensor strip (13) and to a flexible support strip (12) for receiving the sensor strip and for fixing the strip to a surface e.g. to the back of a test person. According to the embodiments, the sensor strip (13) has a reference point (18), (for example a snap fastener connection), with which it can be fixed to a reference surface (16) of the support strip. This allows the position of the sensor strip (13) to be unambiguously defined on the support strip (12). The further extension of the sensor strip (13) lies in a pocket (23) so that it can slide, allowing the relative movement between the support strip and the sensor strip if the support strip is lengthened (represented by a dot-dash line). The entire sensor unit is thus advantageously more comfortable to wear, as the elastic support strip (12), for example, can freely follow the back movements of the test person.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: May 7, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Grigorios Barboutis, Dirk David Goldbeck, Tobias Happel, Andre Matthias Kwiatek, Stefan Nerreter
  • Publication number: 20130063951
    Abstract: A display element and a display device in which the display element is mounted. The display may be a variable message sign. The sign includes a tube-like housing in which lenses and apertures can be disposed. The light exiting a light source is emitted via an emitting surface, by way of which an illuminated traffic sign results from interacting with further display elements. The light source and the optical elements are disposed at different heights in the horizontally oriented housing. The optical axes can thereby extend horizontally, or the optical elements can lie on a main axis which is tilted downward in an radiation direction. In both cases, sunlight impinging from above at an angle advantageously falls on the LED to a slight degree, by way of which the phantom light phenomenon is minimized.
    Type: Application
    Filed: March 22, 2011
    Publication date: March 14, 2013
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Axel Beier, Martin Franke, Stefan Nerreter, Volker Türck
  • Publication number: 20100240981
    Abstract: The embodiments relate to a sensor strip (13) and to a flexible support strip (12) for receiving the sensor strip and for fixing the strip to a surface e.g. to the back of a test person. According to the embodiments, the sensor strip (13) has a reference point (18), (for example a snap fastener connection), with which it can be fixed to a reference surface (16) of the support strip. This allows the position of the sensor strip (13) to be unambiguously defined on the support strip (12). The further extension of the sensor strip (13) lies in a pocket (23) so that it can slide, allowing the relative movement between the support strip and the sensor strip if the support strip is lengthened (represented by a dot-dash line). The entire sensor unit is thus advantageously more comfortable to wear, as the elastic support strip (12), for example, can freely follow the back movements of the test person.
    Type: Application
    Filed: July 15, 2008
    Publication date: September 23, 2010
    Inventors: Grigorios Barboutis, Dirk David Goldbeck, Tobias Happel, Andre Matthias Kwiatex, Stefan Nerreter