Abstract: The invention relates to a device for generating a sequence of laser pulses consisting of pulse bursts. The object of the invention is to provide a possibility of generating laser pulses for material processing in the burst mode at a high quality based on the principle of beam combination.

Abstract: The invention concerns a method and an apparatus for processing an object (1) by means of interfering laser beams. It is the task of the invention to provide for an improved compensation of the aberrations accumulated over the beam path in such processes/apparatuses, since these are a substantial disturbing factor with respect to the precision in structuring the material. Furthermore, the influence of the period course, i.e. the spatial modulation of the period of the modification produced in the material of the object (1), shall be improved. The invention proposes that laser radiation is generated as a collimated laser beam (3). The intensity distribution and/or the phase progression is influenced over the cross-section of the laser beam (3) to correct aberrations. The laser beam (3) is divided into two partial beams (6, 7). Finally, the partial beams (6, 7) are deflected and focused so that the partial beams (6, 7) overlap in a processing zone (10) in the material of the object (1).

Abstract: The invention relates to an arrangement for producing a Bessel beam (5), comprising a beam-forming element (2), which transforms a beam (1) incident as a plane electromagnetic wave into a Bessel beam (5). According to the invention, the beam-forming element (2) comprises at least one annular lens (3, 3?) and a Fourier optical unit, e.g. in the form of a Fourier lens (4).

Abstract: The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of application of laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).

Abstract: The invention relates to a mode filter for reducing higher-order modes, with an optical fiber (1), which has a core (2) and a cladding (3) surrounding the latter, wherein the cladding (3) and core (2) have refractive indices that differ from one another. In order to develop an alternative to the prior art, the mode filter according to the invention is designed in such a manner that the fiber (1) has, in a transition region (4) between core (2) and cladding (3), at least one local refractive index modification region (5) which is arranged in the radially outer region of the core (2) and extends into the region of the cladding (3).

Abstract: The invention relates to a mode filter for reducing higher-order modes, with an optical fibre (1), which has a core (2) and a cladding (3) surrounding the latter, wherein the cladding (3) and core (2) have refractive indices that differ from one another. In order to develop an alternative to the prior art, the mode filter according to the invention is designed in such a manner that the fibre (1) has, in a transition region (4) between core (2) and cladding (3), at least one local refractive index modification region (5) which is arranged in the radially outer region of the core (2) and extends into the region of the cladding (3).

Abstract: The invention relates to a transverse mode filter in an optical waveguide (3). The aim of the invention is to produce a transverse mode filter that permits a monolithic construction of a laser in a multi-mode waveguide. To achieve this, according to the invention the filter comprises a Fabry-Perot cavity integrated into the optical waveguide (3) and comprising two reflective elements (5) situated at a distance from one another. In addition, the waveguide (3) is modified in the region of the Fabry-Perot cavity and/or in the region of the reflective elements (5) in relation to the remaining regions of the waveguide with respect to the effective refractive index of at least one mode of the waveguide.

Abstract: The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.

Abstract: The invention relates to a transverse mode filter in an optical waveguide (3). The aim of the invention is to produce a transverse mode filter that permits a monolithic construction of a laser in a multi-mode waveguide. To achieve this, according to the invention the filter comprises a Fabry-Perot cavity integrated into the optical waveguide (3) and comprising two reflective elements (5) situated at a distance from one another. In addition, the waveguide (3) is modified in the region of the Fabry-Perot cavity and/or in the region of the reflective elements (5) in relation to the remaining regions of the waveguide with respect to the effective refractive index of at least one mode of the waveguide.

Abstract: The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.