Patents by Inventor Stefan Pargfrieder

Stefan Pargfrieder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for aligning and pre-fixing a wafer
    Patent number: 9449863
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: September 20, 2016
    Assignee: EV Group GmbH
    Inventors: Jurgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
  • Receiving device for receiving semiconductor substrates
    Patent number: 9278433
    Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 8, 2016
    Assignee: EV GROUP GMBH
    Inventors: Herbert Tiefenböck, Jürgen Burggraf, Stefan Pargfrieder, Daniel Burgstaller
  • DEVICE FOR ALIGNING AND PRE-FIXING A WAFER
    Publication number: 20150089783
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Application
    Filed: November 10, 2014
    Publication date: April 2, 2015
    Applicant: EV Group GmbH
    Inventors: Jurgen BURGGRAF, Friedrich Paul LINDNER, Stefan PARGFRIEDER, Daniel BURGSTALLER
  • Device for aligning and pre-fixing a wafer
    Patent number: 8918989
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: December 30, 2014
    Assignee: EV Group GmbH
    Inventors: Jürgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
  • RECEIVING DEVICE FOR RECEIVING SEMICONDUCTOR SUBSTRATES
    Publication number: 20120146273
    Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
    Type: Application
    Filed: March 31, 2010
    Publication date: June 14, 2012
    Inventors: Herbert Tiefenböck, Jürgen Burggraf, Stefan Pargfrieder, Daniel Burgstaller
  • DEVICE FOR ALIGNING AND PRE-ATTACHING A WAFER
    Publication number: 20120110825
    Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate, the device having: aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by action on the substrate's outside contour, whereby the orientation along a substrate plane E that is formed with the carrier substrate is carried out by a contact surface of the substrate, and attaching means for at least partial prefixing of the oriented substrate on the carrier substrate.
    Type: Application
    Filed: March 31, 2010
    Publication date: May 10, 2012
    Inventors: Jürgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller