Abstract: A light detection and ranging (LIDAR) device including a laser source configured to provide a transmit beam, the laser source being positioned with a first offset relative to a reference line, a transmit/receive (T/R) interface configured to pass the transmit beam and reflect received light towards a detector, the T/R interface being positioned with a second offset relative to the reference line, and a lens positioned between the laser source and the T/R interface, the lens being positioned with a third offset relative to the reference line, wherein the laser source and the lens, as positioned, are configured to steer the transmit beam.

Abstract: A light detection and ranging (LIDAR) device including a plurality of laser sources configured to provide a plurality of transmit beams, each laser source being positioned with a respective offset of a first plurality of offsets relative to a reference line, a plurality of transmit/receive (T/R) interfaces configured to pass the plurality of transmit beams and reflect received light towards a plurality of detectors, each T/R interface being positioned with a respective offset of a second plurality of offsets relative to the reference line, and a plurality of lenses positioned between the plurality of laser sources and the plurality of T/R interfaces, each lens being positioned with a respective offset of a third plurality of offsets relative to the reference line, wherein the plurality of laser sources and the plurality of lenses, as positioned, are configured to provide beam-steering of the plurality of transmit beams.

Abstract: A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.

Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

Abstract: In one embodiment, an apparatus for optical communication is disclosed. An optical sub-assembly and optical platform may form the apparatus. Lasers contained in the hermetically sealed optical sub-assembly can be coupled to a modulator on the optical platform. The optical modulator can access an optical network using beams of light sent from the laser.

Abstract: An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.

Abstract: An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.

Abstract: In one embodiment, an apparatus for optical communication is disclosed. An optical sub-assembly and optical platform may form the apparatus. Lasers contained in the hermetically sealed optical sub-assembly can be coupled to a modulator on the optical platform. The optical modulator can access an optical network using beams of light sent from the laser.

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.

Abstract: A single piece optoelectronic module housing is disclosed herein. The housing comprises a first receptacle configured to receive a first optical assembly, a second receptacle configured to receive a second optical assembly, and a third receptacle configured to receive an optical fiber. In some embodiments at least one angled surface configured to have a filter placed thereon is included. In other embodiments, two or more angled pocket receptacles configured to have one or more optical elements placed therein are included. Further embodiments include at least one compliant press fit feature implemented as part of one of the receptacles. The optoelectronic module housing is a single piece housing configured such that the receptacles and other components are integral parts of the single piece housing.

Abstract: A lens mount assembly for securing a lens in a predetermined position within an optical device is disclosed. The lens mount assembly is configured so as to retain the lens in a press fit arrangement, thereby eliminating the need for adhesives or other mechanical means in order to secure the lens. In one embodiment the lens mount assembly includes a glass lens having an outer surface with a predetermined amount of surface roughness. A retention tube defines a cylindrical volume and is composed of a compliant material that resiliently deforms when the lens is pressed into the cylindrical volume. The compliant material recompresses a small amount around the lens to secure it within the retention tube. A base is attached to or integrally formed with the retention tube and includes a corrugated surface for securing the lens mount assembly within the optical device.

Abstract: A package for maintaining alignment of components includes a frame and a beam with the beam attached to the frame and one end of the beam. One or more components are mounted to the beam. The frame and a portion of the beam are separated from each other by a channel which allows portions of the beam to flex substantially independently of the frame when a force is applied to the frame. Thus, the effects resulting from forces applied to the frame are not experienced by the beam, or are at least attenuated, so that the alignment of the components mounted on the beam is substantially preserved.

Abstract: A receptacle assembly that receives an optical connector. The receptacle assembly includes a first piece having a central bore with a stepped diameter. The receptacle assembly also includes an annular second piece designed to receive the optical connector and that has an outside surface designed to establish an interference fit with the inside surface of the first piece central bore. Further, the assembly includes an annular third piece that has a constant inner diameter and a stepped outer diameter. The outside surface of the third piece is designed to establish an interference fit with the inside surface of the annular second piece.

Abstract: A lens mount assembly for securing a lens in a predetermined position within an optical device is disclosed. The lens mount assembly is configured so as to retain the lens in a press fit arrangement, thereby eliminating the need for adhesives or other mechanical means in order to secure the lens. In one embodiment the lens mount assembly includes a glass lens having an outer surface with a predetermined amount of surface roughness. A retention tube defines a cylindrical volume and is composed of a compliant material that resiliently deforms when the lens is pressed into the cylindrical volume. The compliant material recompresses a small amount around the lens to secure it within the retention tube. A base is attached to or integrally formed with the retention tube and includes a corrugated surface for securing the lens mount assembly within the optical device.

Abstract: A package for maintaining alignment of components includes a frame and a beam with the beam attached to the frame and one end of the beam. One or more components are mounted to the beam. The frame and a portion of the beam are separated from each other by a channel which allows portions of the beam to flex substantially independently of the frame when a force is applied to the frame. Thus, the effects resulting from forces applied to the frame are not experienced by the beam, or are at least attenuated, so that the alignment of the components mounted on the beam is substantially preserved.