Patents by Inventor Stefan Preble

Stefan Preble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220334312
    Abstract: Disclosed is a method and system applicable to attaching a single or multiple optical fibers in sequence to a photonic integrated circuit enabling precise control of optical fibers and/or multiple types of optical fibers and/or at any pitch. The system and method provide optical alignment and in situ attachment of one or more optical fibers to a photonic integrated circuit chip using a photo-curable adhesive, wherein curing light is delivered to the adhesive by the optical fiber being attached.
    Type: Application
    Filed: April 14, 2022
    Publication date: October 20, 2022
    Applicants: Rochester Institute of Technology, Air Force Research Laboratory
    Inventors: Stefan Preble, Gregory Bond, John Serafini, Matthew van Niekerk, Thomas Palone, Michael Fanto, Mario J. Ciminelli
  • Patent number: 11353659
    Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: June 7, 2022
    Assignee: Rochester Institute of Technology
    Inventors: Mario J. Ciminelli, Stefan Preble, Jeffrey Steidle, Paul Thomas
  • Publication number: 20200310034
    Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 1, 2020
    Applicant: Rochester Institute of Technology
    Inventors: Mario J. Ciminelli, Stefan Preble, Jeffrey Steidle, Paul Thomas
  • Patent number: 10598861
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 24, 2020
    Assignees: Indiana Integrated Circuits, LLC, MRSI Systems, LLC, Rochester Institute of Technology
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Publication number: 20200003955
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Application
    Filed: September 10, 2019
    Publication date: January 2, 2020
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Patent number: 10523331
    Abstract: Delivering a radio frequency (RF) signal to a remote phased array antenna system involves using an optical modulator at an RF source location to modulate a high power optical carrier signal with a source RF signal SRF so as to produce a high power transmit modulated optical carrier (TMOC) signal. An optical link communicates the high power TMOC signal to a remote antenna location, where the high power TMOC is split into N optical paths to obtain N reduced power TMOC signals. In each of the N optical paths, photodetection operations are performed upon the reduced power TMOC signal to obtain N reduced power S?RF signals which are then constructively combined to obtain a high power S?RF signal which is communicated to at least one antenna element.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: December 31, 2019
    Assignee: PRECISION OPTICAL TRANSCEIVERS INC.
    Inventors: David M. Calhoun, Stefan Preble
  • Patent number: 10409004
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: September 10, 2019
    Assignees: Indiana Integrated Circuits, LLC, MRSI Systems, LLC, Rochester Institute of Technology
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Publication number: 20190250335
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Application
    Filed: July 19, 2017
    Publication date: August 15, 2019
    Applicants: Indiana Integrated Circuits, LLC, Rochester Institute of Technology, MRSI Systems, LLC
    Inventors: Jason M. KULICK, Yi QIAN, Stefan PREBLE, Jeffrey STEIDLE, Michael FANTO, Tian LU
  • Publication number: 20190222320
    Abstract: Delivering a radio frequency (RF) signal to a remote phased array antenna system involves using an optical modulator at an RF source location to modulate a high power optical carrier signal with a source RF signal SRF so as to produce a high power transmit modulated optical carrier (TMOC) signal. An optical link communicates the high power TMOC signal to a remote antenna location, where the high power TMOC is split into N optical paths to obtain N reduced power TMOC signals. In each of the N optical paths, photodetection operations are performed upon the reduced power TMOC signal to obtain N reduced power S?RF signals which are then constructively combined to obtain a high power S?RF signal which is communicated to at least one antenna element.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 18, 2019
    Inventors: David M. Calhoun, Stefan Preble
  • Patent number: 9086584
    Abstract: A wavelength converter includes an optical resonator that is optically coupled to a waveguide. The refractive index of the optical resonator is dynamically changed, such as by injecting free carriers into the resonator. This effectively changes that optical path length of the light, thus converting the wavelength.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: July 21, 2015
    Assignee: Cornell University
    Inventors: Stefan Preble, Michal Lipson
  • Publication number: 20110013266
    Abstract: A wavelength converter includes an optical resonator that is optically coupled to a waveguide. The refractive index of the optical resonator is dynamically changed, such as by injecting free carriers into the resonator. This effectively changes that optical path length of the light, thus converting the wavelength.
    Type: Application
    Filed: August 24, 2007
    Publication date: January 20, 2011
    Applicant: Cornell Research Foundation, Inc.
    Inventors: Stefan Preble, Michal Lipson