Abstract: A device, e.g., a heat exchanger, is disclosed. The device includes a first component and a second component. The first component has at least a first surface portion and a second surface portion. The first surface portion and the second surface portion are located opposite to one another and are spaced apart from one another. The first component includes a first support groove provided at the first surface portion and a functional groove provided at the first surface portion. The functional groove is arranged spaced apart from the first support groove at least in some sections. The functional groove is structured and arranged for partially receiving a second component for a substance-to-substance bond.

Abstract: The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.

Abstract: The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.

Abstract: A heat exchanger includes a block for the separated and heat-exchanging guiding of first and second fluids, the block having a number of fluid flow channels, at least one box which is flow-connected to the flow channels, and at least one base that includes one or more openings for feeding the flow channels from the box. At least one opening is formed as a passage with a collar having a near-bottom section and an end-side section, and a wall thickness of the end-side section is smaller than a wall thickness of the near-bottom section. A shoulder between the near-bottom and end-side section has a contour running transverse to the contour of the near-bottom section and/or the end-side section, and the end-side section is inclined away from a passage axis. Also a manufacturing process for a heat exchanger.

Abstract: A heat exchanger is provided for heat transfer between a first fluid, particularly charge air or an exhaust gas, and a second fluid, particularly a coolant, which has: a block for the separated and heat-exchanging guiding of the first and second fluid, the block which has a number of flow channels through which the first fluid can flow, at least one box which is assigned to the block and is flow-connected to the flow channels, and at least one base, which is provided with one or with more through openings for feeding through the flow channels between the block and the box, whereby at least one through opening is formed as a passage with a collar.

Abstract: A method and a device for temperature measurement of the fluid at the outlet from an evaporator in a boiler of benson type, wherein the evaporator includes one or more inlet headers which are supplied with water passed on to evaporator tubes which communicate with a heat-transferring medium and wherein the water is transformed into a fluid which is then via evaporator stubs passed to one or more outlet headers of the evaporator, the temperature of the fluid being measured with the aid of temperature sensors which are placed on adjacently located evaporator stubs for a number of important and critical parts of the boiler, the measured values for each part being supplied to median value selectors whereafter each median value is supplied to a maximum selector, whereby the maximum temperature (t.sub.max) of any of the outlets from the evaporator is obtained, and to a means temperature (t.sub.mean) of the fluid at the outlet of the evaporator is obtained.