Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.

Abstract: A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.

Abstract: The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere.

Abstract: Arrangement and method for testing a substrate under load with a prober are provided, by which the full productivity of the prober can be exploited. The arrangement includes a chuck, a chuck driver, control electronics, probe or probe card holding means, and has a loading means for applying a thermal, mechanical, electrical or other physical or chemical loading to the substrate. The substrate is subjected to a loading and then its properties are measured by means of the prober. The loading means is arranged as a separate subassembly separated from the prober and therein is connected to the latter via a handling system. The method provides for the substrate to be brought into operative connection with a loading means, subjected to the loading in this loading means, then removed from the loading means and tested in terms of its functions.

Abstract: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

Abstract: A substrate-holding device is designed as a one-piece ceramic element having a number of variably heavily doped layer regions. At least one layer region is a conductive region and at least one layer region is an insulative region. A multilayer chuck structure is thereby formed which does not exhibit mechanical surface interfaces between the layers.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: The invention, which relates to a method for testing movement-sensitive substrates, in which a substrate is mounted on a chuck and makes contact with contact-making needles, and relates to an apparatus which is provided with a chuck which is connected to a positioning apparatus and has contact needles, is based on the object of allowing testing of physical characteristics relating to the mechanical dynamic response of movement-sensitive substrates. This object is achieved in that the substrate is mechanically accelerated during the determination of the physical characteristics. The chuck in this case comprises a lower chuck member and an upper chuck member, with the two chuck members are arranged to move relative to one another, and with at least one movement element being arranged between the two chuck members.

Abstract: The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere.

Abstract: A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.

Abstract: The invention relates to a tester for pressure sensors in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head is provided which has an interior space open on one side, the open face of which is capable of being mounted on the pressure sensor in such a way that the interior space is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element at least so that the sensor element is moved out of its resting position. At the same time, the electrical connections of the selected pressure sensor are connected with an electrical evaluation unit.

Abstract: A substrate-holding device is designed as a one-piece ceramic element having a number of variably heavily doped layer regions. At least one layer region is a conductive region and at least one layer region is an insulative region. A multilayer chuck structure is thereby formed which does not exhibit mechanical surface interfaces between the layers.

Abstract: The invention relates to a tester for pressure sensors (1) in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting (7) of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head (9) is provided which has an interior space (10) open on one side, the open face (11) of which is capable of being mounted on the pressure sensor (1) in such a way that the interior space (10) is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element (4) at least so that the sensor element (4) is moved out of its resting position. At the same time, the electrical connections (7) of the selected pressure sensor (1) are connected with an electrical evaluation unit (21).