Abstract: A method for producing a measuring head housing for an integrated measuring system of a linear bearing of a profile rail guide includes providing a cover blank of a flat material with an adhesive layer and bending the cover blank to form a cover. A cover for a measuring head housing and a measuring head housing are also disclosed.

Abstract: A method for producing a measuring head housing for an integrated measuring system of a linear bearing of a profile rail guide includes providing a cover blank of a flat material with an adhesive layer and bending the cover blank to form a cover. A cover for a measuring head housing and a measuring head housing are also disclosed.

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Abstract: A method for determining the temperature of a power semiconductor, wherein a first control contact is connected to a first pole of a series resistor integrated in the power semiconductor. A second pole—which continues to the power semiconductor—of the series resistor is connected to a second control contact. A first control contact and a second control contact are connected to a first connection terminal and second connection terminal via respective bonding wires. The resistance value of the series resistor is determined by an electrical measurement between the two connection terminals. On the basis of the resistance value and a temperature-resistance characteristic curve of the series resistor, the temperature of the power semiconductor is determined based on the temperature of the series resistor.

Abstract: A method for determining the temperature of a power semiconductor, wherein a first control contact is connected to a first pole of a series resistor integrated in the power semiconductor. A second pole—which continues to the power semiconductor—of the series resistor is connected to a second control contact. A first control contact and a second control contact are connected to a first connection terminal and second connection terminal via respective bonding wires. The resistance value of the series resistor is determined by an electrical measurement between the two connection terminals. On the basis of the resistance value and a temperature-resistance characteristic curve of the series resistor, the temperature of the power semiconductor is determined based on the temperature of the series resistor.

Abstract: A device for detecting a relative movement between two machine parts movable relative to one another has a plurality of marking rulers arranged on one of the machine parts one after the other in direction of the relative movement of the machine parts and having increment markings for detecting a distance of a relative movement of the both machine parts, two sensors for sensing of the marking rulers and arranged on the other of the machine parts at the predetermined distance in the direction of relative movement of the machine parts, the sensors sensing the increment markings and each providing a sensing signal; the marking rulers being arranged so that distances between two neighboring ones of the marking rulers being smaller than the predetermined distance between the sensors, an evaluating unit operative for determining an absolute position of the corresponding sensor between two successive increment markings based on a phase position of the sensing signal of the sensors.

Abstract: A device for detecting a relative movement between two machine parts movable relative to one another has a plurality of marking rulers arranged on one of the machine parts one after the other in direction of the relative movement of the machine parts and having increment markings for detecting a distance of a relative movement of the both machine parts, two sensors for sensing of the marking rulers and arranged on the other of the machine parts at the predetermined distance in the direction of relative movement of the machine parts, the sensors sensing the increment markings and each providing a sensing signal; the marking rulers being arranged so that distances between two neighboring ones of the marking rulers being smaller than the predetermined distance between the sensors, an evaluating unit operative for determining an absolute position of the corresponding sensor between two successive increment markings based on a phase position of the sensing signal of the sensors.