Abstract: A solar cell includes a silicon substrate with a front-side and a rear-side; a dielectric layer structure on the rear-side of the silicon substrate, wherein the dielectric layer structure includes a plurality of through openings by means of which the rear-side of the silicon substrate is exposed; a printed Aluminum-containing metallization layer on the dielectric layer structure on the rear-side of the silicon substrate and at least partially in the through openings for electrically contacting the rear-side of the silicon substrate; wherein the Aluminum-containing metallization includes a lower layer thickness in a first area than in a second area, or the first area is free from the Aluminum-containing metallization; wherein at least one through opening of the plurality of through openings is at least partially disposed in the first area or borders on the first area or has a distance from the first area of less than 500 ?m.

Abstract: A solar cell array is made of a plurality of bifacial PERC solar cells, respectively formed in a semiconductor body, which are electrically interconnected by way of cell connectors. A structured passivation layer is applied on the rear-side surface of the semiconductor body, on which the current collecting rails and contact finger contacting the semiconductor body are provided. A respective cell connector extends at least partially along a longitudinal direction of at least one current collecting rail and electrically contacts this on at least one solder contact via a solder joint. A lateral width of a current collecting rail is at least partially greater than a lateral width of the cell connector covering this current collecting rail.

Abstract: Solar cell including a semiconductor substrate with a first and second side, a first contact structure disposed in the region of the first side of the semiconductor substrate and contacting the semiconductor substrate, a passivation layer with openings disposed on the second side of the semiconductor substrate, and a second contact structure disposed on the passivation layer, which locally contacts the semiconductor substrate through the openings of the passivation layer, wherein the first contact structure has a strip-shaped connection element and contact fingers connected to the connection element, and wherein the passivation layer has an openings-free region extending along the connection element in a region under the strip-shaped connection element of the first contact structure.

Abstract: A solar cell with a semiconductor body and with a contact layout for electrically connecting a surface of the semiconductor body, including: a plurality of current collecting contact fingers, which are disposed substantially parallel to each other, wherein the contact finger respectively has a line resistance of at least 100 ?/m, a plurality of busbars, which are electrically connected to the contact fingers, and at least one cell connector continuously connecting the busbar, wherein the contact fingers and the busbar are dimensioned, particularly in terms of the material properties thereof, layout on the semiconductor body thereof, width and layer thickness thereof, that the contact layout has a series resistance of maximum 1 ?cm2.

Abstract: In various embodiments, a solar cell is provided, comprising: a substrate with a front-side and a rear-side, wherein at least the front-side receives light; a passivation layer on the rear-side of the substrate; local contact openings, which pass through the passivation layer and partially expose the rear-side of the substrate; and a first rear-side metallization on the passivation layer and in the local contact openings; wherein the plurality of the local contact openings are disposed such that they are completely covered by the first rear-side metallization.

Abstract: The present invention describes a solar cell with a Silicon substrate, which includes a doped emitter region on which a contact structure is disposed, which includes several linear contact-fingers, wherein the distance between the contact-fingers varies and is adjusted to a changing doping profile over the surface of the emitter region.

Abstract: A photovoltaic module has a number of solar cells, which respectively include a contact structure on a pre-processed silicon wafer, which has a number of linear contact fingers disposed in parallel in a first direction and at least one bus bar disposed perpendicular to the first direction. The bus bar extends over the contact finger in a second direction and has a respective contact surface in the region of the contact finger, which protrudes above the contact finger in the second direction and is electrically connected to the contact fingers. At least one cell connector is provided for connecting the solar cells, which extends over the bus bar of at least one solar cell and is electrically connected to the contact surfaces of the bus bar, wherein the width of the cell connector is smaller than the length of the contact surface in the first direction.

Abstract: In various embodiments, an apparatus for transporting wafers is provided. The apparatus may include a transport belt configured to transport wafers in a transport direction; wherein the transport belt is provided with supports configured to support the wafers to be transported; wherein the supports are provided with at least one bearing element for compensating for relative movements between the transport belt and the wafer.

Abstract: In various embodiments, an apparatus for transporting wafers is provided. The apparatus may include a transport belt configured to transport wafers in a transport direction; wherein the transport belt is provided with supports configured to support the wafers to be transported; wherein the supports are provided with at least one bearing element for compensating for relative movements between the transport belt and the wafer.