Abstract: A semiconductor arrangement includes a semiconductor element having a connection element, and a metallic contacting element connected flatly to the connection element of the semiconductor element by being sprayed onto the semiconductor element via a thermal spraying method involving atmospheric plasma spraying. The metallic contacting element incudes first and second particles which form a textured layer, with the first particles deformed in a planar-like manner and with the second particles being melted second particles, said first particles being at least five times larger than the second particles.

Abstract: An arrangement for a semiconductor arrangement includes a substrate including a dielectric material layer and a first metallization arranged on the dielectric material layer. A passive component is arranged completely in a cutout of the first metallization and bears directly on the dielectric material layer. The passive component is designed to include a first profile. The the first metallization includes a second profile in a region of contacting with the passive component, with the first and second profiles engaging with one another.

Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.

Abstract: Various embodiments of the teachings herein include a method of establishing a solder bond between a first solder partner and a second solder partner with a solder medium including a metallic solder material and a multitude of magnetic nanoparticles. An example method includes: a) generating a magnetic alternating field with a magnet coil acting on the solder medium; b) heating the magnetic nanoparticles via the interaction with the magnetic alternating field; and c) melting the metallic solder material owing to heat transfer from the magnetic nanoparticles to the metallic solder material and thereby forming the solder bond between the first solder partner and the second solder partner with molten metallic solder material.

Abstract: A mount includes a first metal element having a first surface for connection to a heat source, and a second metal element having a second surface for connection to a heat sink. A body made of plastic, glass or ceramic is arranged so as to abut against the first and second metal elements. The body includes through-openings which extend from a region of the first surface to a region of the second surface. The mount includes grooves in the region of the first surface and in the region of the second surface. The grooves extend over two of the through-openings. The first and second metal elements are arranged on the body such that a closed cooling channel is formed by the through-openings, the grooves and the first and second metal elements.

Abstract: A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

Abstract: Various embodiments of the teachings herein include power electronics assemblies. An example assembly includes: a substrate with a metallization forming first and second structures separated from each other by interspaces and with thickness of at least 300 ?m; a power semiconductor mounted on the first structure; and an electric insulator having a thermal conductivity of at least 50 W/mK arranged at least sectionally in such a way that the structures adjacent to the respective interspace are thermally connected by the insulator.

Abstract: Various embodiments of the teachings herein include an electronics assembly comprising: a circuit carrier; a semiconductor chip mounted on the circuit carrier; and a heat sink. The circuit carrier and the semiconductor chip each have a planar basic shape extending along parallel principal planes. The heat sink is arranged in a first edge region of the parallel principle planes. The circuit carrier includes a thick-film conductor track defining a principal heat dissipation path between a first edge region of the semiconductor chip and the first edge region of the circuit carrier. The thick-film conductor track is thermally coupled to the heat sink and has a layer thickness of at least 300 ?m. The principal heat dissipation path runs parallel to the principal plane of the semiconductor chip to the heat sink in the first edge region. The semiconductor chip is bonded both electrically and also thermally to the conductor track.

Abstract: A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

Abstract: An X-ray high-voltage generator comprises: a circuit arrangement having at least one power electronics circuit part, wherein the at least one power electronics circuit part is configured to form a heat source during operation; and a two-phase cooling system having a heat sink. The at least one power electronics circuit part is directly thermally coupled to the two-phase cooling system to cool the heat source at the heat sink. The two-phase cooling system has a cooling element block that spatially surrounds a cooling channel circuit. The cooling channel circuit is at least partially filled with a working medium, and is configured to act as a heat pipe.

Abstract: A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

Abstract: An X-ray high-voltage generator comprises: a circuit arrangement having at least one power electronics circuit part, wherein the at least one power electronics circuit part is configured to form a heat source during operation; and a two-phase cooling system having a heat sink. The at least one power electronics circuit part is directly thermally coupled to the two-phase cooling system to cool the heat source at the heat sink. The two-phase cooling system has a cooling element block that spatially surrounds a cooling channel circuit. The cooling channel circuit is at least partially filled with a working medium, and is configured to act as a heat pipe.

Abstract: The disclosure is based on a medical imaging apparatus with a scanner, a patient support apparatus and a housing, which is arranged on the scanner and/or on the patient support apparatus, wherein the housing comprises at least one functional housing shell, wherein the at least one functional housing shell comprises at least one sensor element for detection of a hygiene status on the at least one functional housing shell, at least one output element, which is embodied for a visual display of the hygiene status, and at least one cleaning element for cleaning a surface of the at least one functional housing shell.

Abstract: Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.

Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

Abstract: The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.

Abstract: A method for fabricating a conductor track, the method comprising: applying a first metallic and electrically conductive material to form the conductor track; and spraying a second metallic material on the conductor track; wherein the second metallic material has a lower melting point than the first material.

Abstract: The invention relates to an arrangement for a power converter (12) comprising at least one power module (1) comprising power semiconductor components (5) and a cooler (10), wherein the cooler (10) has a curved surface and the power module (1) is arranged on the surface and is connected in a positive fit to the cooler (10). The invention also relates to an associated manufacturing method as well as to a power converter with said type of arrangement and to a vehicle with a power converter.

Abstract: Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.