Abstract: A fitting (1), at least comprising a housing (2) having a housing wall (3), a mixing cartridge (4), arranged in the housing (2), having a first feed connection (5), a second feed connection (6), a mixing region (7) for mixing a fluid flowing into the mixing region (7) via the feed connections (5, 6), and an outlet connection (8) via which the fluid can flow out of the mixing region (7) and out of the mixing cartridge (4); an actuation unit (9) for actuating the mixing cartridge (4) and a hose (10); the hose (10) being connected to the outlet connection (8) by means of a first end (11) and being arranged in a moveable manner on the housing (2) by means of a second end (12); the hose (10) extending through a channel (13) of the mixing cartridge (4), the mixing region (7) being arranged at least partially between the channel (13) and the housing wall (3).

Abstract: A valve headpart (1) for a sanitary faucet (2), containing at least: a body (3), a valve stem (4), which is at least partially disposed in the body (3) and can be rotated relative to the body (3) about an axis of rotation (5), a seal (6) for at least partially closing a valve seat (7) of the sanitary faucet (2), wherein the seal (6) can be adjusted by the valve stem (4) parallel to the axis of rotation (5) between an open position and a closed position, wherein the seal (6) has a first sealing element (8) made of a first material and a second sealing element (9) made of a second material, and wherein a first hardness of the first material is lower than a second hardness of the second material. Moreover, a sanitary faucet (2) having such a valve headpart (1) is proposed.

Abstract: A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.

Abstract: A transient voltage suppression (TVS) device and method of formation. A TVS device may include a first layer, disposed on a first surface of a substrate, comprising a first P+ layer; a second layer, disposed on a second surface of the substrate, opposite the first surface, comprising a second P+ layer; a third layer, disposed between the first P+ layer and the second P+ layer, comprising an N? layer; and an isolation diffusion region, comprising a P structure, connected to the second P+ layer, and extending along a perimeter of the N? layer.

Abstract: A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.

Abstract: A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.

Abstract: A single-lever cartridge for a sanitary faucet for adjusting the temperature and/or quantity of mixed water by means of a swivel lever (3), having a control disk arrangement (5), which has a stationary control disk (6) disposed in a stationary position in the cartridge, in which a cold-water inlet and a hot-water inlet (27, 29) and a mixed-water outlet (31) are formed, and a dynamic control disk (8) displaceable by means of the swivel lever (3), in which a recess (33) is formed, which is disposed in different overlaps with the cold-water inlets and hot-water inlets (29, 27) and the mixed-water outlet (31) to adjust the temperature and/or quantity of the mixed water fed from the mixed-water outlet (31) of the stationary control disk (6), wherein the two control disks (6, 8) are in sliding contact with sealing surfaces (35, 37) facing each other at a sealing plane (DE), and wherein the mouths (39) of the cold-water inlets and hot-water inlets (29, 27) are formed in the sealing surface (35) of the stationary con

Abstract: A fitting (1), at least comprising a housing (2) having a housing wall (3), a mixing cartridge (4), arranged in the housing (2), having a first feed connection (5), a second feed connection (6), a mixing region (7) for mixing a fluid flowing into the mixing region (7) via the feed connections (5, 6), and an outlet connection (8) via which the fluid can flow out of the mixing region (7) and out of the mixing cartridge (4); an actuation unit (9) for actuating the mixing cartridge (4) and a hose (10); the hose (10) being connected to the outlet connection (8) by means of a first end (11) and being arranged in a moveable manner on the housing (2) by means of a second end (12); the hose (10) extending through a channel (13) of the mixing cartridge (4), the mixing region (7) being arranged at least partially between the channel (13) and the housing wall (3).

Abstract: A semiconductor device structure may include a semiconductor device, disposed at least in part in a semiconductor substrate, and a first insulator layer, disposed on a surface of the semiconductor device, and comprising a first contact aperture, disposed within the first insulator layer. The semiconductor device structure may also include a first contact layer, comprising a first electrically conductive material, disposed over the insulator layer, and being in electrical contact with the semiconductor device through the first contact aperture, and a second insulator layer, disposed over the first contact layer, wherein the second insulator layer further includes a second contact aperture, displaced laterally from the first contact aperture, by a first distance.

Abstract: A semiconductor device substrate assembly may include a first substrate, comprising: a first insulator plate; and a first patterned metal layer, disposed on the first insulator plate, wherein the first insulator plate comprises a first material and a first thickness. The assembly may include a second substrate, comprising: a second insulator plate; and a second patterned metal layer, disposed on the second insulator plate, wherein the second insulator plate comprises the first material and the first thickness. The assembly may also include a third substrate, disposed between the first substrate and the second substrate, comprising: a third insulator plate; and a third patterned metal layer, disposed on the third insulator plate, wherein the third insulator plate comprises a second material and a second thickness, wherein at least one of the second material and the second thickness differs from the first material and the first thickness, respectively.

Abstract: A semiconductor device structure may include a semiconductor device, disposed at least in part in a semiconductor substrate, and a first insulator layer, disposed on a surface of the semiconductor device, and comprising a first contact aperture, disposed within the first insulator layer. The semiconductor device structure may also include a first contact layer, comprising a first electrically conductive material, disposed over the insulator layer, and being in electrical contact with the semiconductor device through the first contact aperture, and a second insulator layer, disposed over the first contact layer, wherein the second insulator layer further includes a second contact aperture, displaced laterally from the first contact aperture, by a first distance.

Abstract: A method for operating a sanitary fitting, and to a sanitary fitting. The sanitary fitting is equipped to deliver a water jet and has at least one manual actuator for manual regulation of at least one water jet flow rate or a water jet temperature, and a sensor arrangement that is equipped for sensor-controlled regulation of a predefined water jet flow rate and a predefined water jet temperature. The sensor arrangement is equipped to detect the presence of an object in an external detection area and a control unit is provided to distinguish whether the object detected first is a water jet or a different object.

Abstract: A method for operating a sanitary fitting, and to a sanitary fitting. The sanitary fitting is equipped to deliver a water jet and has at least one manual actuator for manual regulation of at least one water jet flow rate or a water jet temperature, and a sensor arrangement that is equipped for sensor-controlled regulation of a predefined water jet flow rate and a predefined water jet temperature, wherein the sensor arrangement is equipped to detect the presence of an object in an external detection area and wherein a control unit is provided that is equipped to evaluate an object detected first and to distinguish whether the object detected first is a water jet or a different object. The present invention makes possible an economical production, the use of standard components, and low wear.

Abstract: Within a cassette of a press pack module, a conductive shim is bonded to the backside of a device die by a layer of sintered metal. The die, sintered metal, and shim together form a sintered assembly. The cassette is compressed between a metal top plate member and a metal bottom plate member such that the backside of the assembly is pressed against the top plate member, and such that the frontside of the assembly is pressed against another shim. A central portion of the frontside surface of the die is contacted on the bottom by the other shim, but there is no shim contacting a peripheral portion of the frontside surface. Despite there being no shim in contact with the peripheral portion of the frontside surface, the peripheral portion is in good thermal contact with the top plate member through the sintered metal and the bonded conductive shim.

Abstract: Within a cassette of a press pack module, a conductive shim is bonded to the backside of a device die by a layer of sintered metal. The die, sintered metal, and shim together form a sintered assembly. The cassette is compressed between a metal top plate member and a metal bottom plate member such that the backside of the assembly is pressed against the top plate member, and such that the frontside of the assembly is pressed against another shim. A central portion of the frontside surface of the die is contacted on the bottom by the other shim, but there is no shim contacting a peripheral portion of the frontside surface. Despite there being no shim in contact with the peripheral portion of the frontside surface, the peripheral portion is in good thermal contact with the top plate member through the sintered metal and the bonded conductive shim.

Abstract: A control disk for a control set of a sanitary mixing faucet, in each case with at least one through passage for cold water and hot water and an outlet for the mixed water and at least one through passage has a cross section that becomes smaller in the circumferential direction and extends over an angle (?) of at least 15°.

Abstract: A mixing valve has a housing, hot- and cold-water valves in the housing having respective valve stems rotatable about respective parallel axes, respective drive gears fixed on the stems, respective hot- and cold-water control elements pivotal on the housing, and respective coupling gears each connected to a respective one of the control elements and meshing with a respective one of the drive gears. The coupling gears each have a pair of gear segments of different effective radii, one of the gear segments of each coupling gear meshing with the respective valve drive gear and the other gear segment with the respective control element. The radii are such that the coupling gears create a step-down ratio of about 1:1.6.

Abstract: A mixing faucet adapted to be mounted on a support body having an outside face, an inside face, and a hole extending between the faces has a faucet body adapted to sit on the outside face over the hole, a mixing valve in the body having hot- and cold-water inlet ports and a mixed-water outlet port, and a rigid tubular stem fixed to the body, extending through the hole, formed with a passage connected to one of the ports, having at the outer face an external screwthread, and having an outer end. At least one conduit extends through the hole and is connected to another of the ports. A nut is threaded onto the external screwthread of the stem and bears against the inside face.