Patents by Inventor Stefan Turalski

Stefan Turalski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer having a thin die and tethers and methods of making the same
    Patent number: 6881648
    Abstract: A semiconductor wafer (70) that includes a support body (72), at least one thin die (20, 60), and a plurality of tethers (78, 178). The support body (72) is made of a semiconductor material. The thin die (20, 60) has a circuit (21) formed thereon and has an outer perimeter (74) defined by an open trench (76). The open trench (76) separates the thin die (20, 60) from the support body (72). The tethers (78, 178) extend across the open trench (76) and between the support body (72) and the thin die (20, 60). A method of making a thin die (20, 60) on a wafer (70) where the wafer (70) has a support body (72), a topside (82) and a backside (90). A circuit (21) is formed on the topside (82) of the wafer (70).
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 19, 2005
    Assignee: Motorola, Inc.
    Inventors: Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski
  • Semiconductor wafer having a thin die and tethers and methods of making the same
    Publication number: 20030162322
    Abstract: A semiconductor wafer (70) that includes a support body (72), at least one thin die (20, 60), and a plurality of tethers (78, 178). The support body (72) is made of a semiconductor material. The thin die (20, 60) has a circuit (21) formed thereon and has an outer perimeter (74) defined by an open trench (76). The open trench (76) separates the thin die (20, 60) from the support body (72). The tethers (78, 178) extend across the open trench (76) and between the support body (72) and the thin die (20, 60). A method of making a thin die (20, 60) on a wafer (70) where the wafer (70) has a support body (72), a topside (82) and a backside (90). A circuit (21) is formed on the topside (82) of the wafer (70).
    Type: Application
    Filed: March 13, 2003
    Publication date: August 28, 2003
    Inventors: Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski
  • Semiconductor wafer having a thin die and tethers and methods of making the same
    Patent number: 6608370
    Abstract: A semiconductor wafer (70) that includes a support body (72), at least one thin die (20, 60), and a plurality of tethers (78, 178). The support body (72) is made of a semiconductor material. The thin die (20, 60) has a circuit (21) formed thereon and has an outer perimeter (74) defined by an open trench (76). The open trench (76) separates the thin die (20, 60) from the support body (72). The tethers (78, 178) extend across the open trench (76) and between the support body (72) and the thin die (20, 60). A method of making a thin die (20, 60) on a wafer (70) where the wafer (70) has a support body (72), a topside (82) and a backside (90). A circuit (21) is formed on the topside (82) of the wafer (70).
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: August 19, 2003
    Assignee: Motorola, Inc.
    Inventors: Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski
  • SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MAKING THE SAME
    Publication number: 20030141570
    Abstract: A semiconductor wafer (70) that includes a support body (72), at least one thin die (20, 60), and a plurality of tethers (78, 178). The support body (72) is made of a semiconductor material. The thin die (20, 60) has a circuit (21) formed thereon and has an outer perimeter (74) defined by an open trench (76). The open trench (76) separates the thin die (20, 60) from the support body (72). The tethers (78, 178) extend across the open trench (76) and between the support body (72) and the thin die (20, 60). A method of making a thin die (20, 60) on a wafer (70) where the wafer (70) has a support body (72), a topside (82) and a backside (90). A circuit (21) is formed on the topside (82) of the wafer (70).
    Type: Application
    Filed: January 28, 2002
    Publication date: July 31, 2003
    Inventors: Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski