Patents by Inventor Stefan Ufer

Stefan Ufer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220265647
    Abstract: The present invention relates to pharmaceutical compositions for inhalation comprising a therapeutically effective dose of clofazimine wherein the clofazimine is provided in the form of a suspension, and processes for their preparation. Furthermore, the present invention provides pharmaceutical combinations comprising clofazimine in the form of an aerosol for pulmonary inhalation. The combinations and compositions provided by the present invention may be used in the treatment and/or prophylaxis of pulmonary infections caused by mycobacteria and other gram-positive bacteria, and of pulmonary fungal infections.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 25, 2022
    Applicant: MannKind Corporation
    Inventors: Thomas Hofmann, Stefan Ufer, Kevin Stapleton
  • Publication number: 20220023282
    Abstract: The present invention relates to pharmaceutical compositions for inhalation comprising a therapeutically effective dose of bedaquiline wherein the bedaquiline is provided in the form of a suspension, or in which the bedaquiline is provided in the form of a dry powder, and processes for their preparation. Furthermore, the present invention provides pharmaceutical combinations comprising bedaquiline in the form of an aerosol for pulmonary inhalation. The combinations and compositions provided by the present invention may be used in the treatment and/or prophylaxis of pulmonary infections caused by mycobacteria and other gram-positive bacteria.
    Type: Application
    Filed: December 9, 2019
    Publication date: January 27, 2022
    Applicant: MannKind Corporation
    Inventors: Thomas Hofmann, Stefan Ufer, Kevin Stapleton
  • Patent number: 8836125
    Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: September 16, 2014
    Assignee: Premitec, Inc.
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Publication number: 20130309809
    Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.
    Type: Application
    Filed: July 24, 2013
    Publication date: November 21, 2013
    Applicant: Premitec, Inc.
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Patent number: 8525340
    Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: September 3, 2013
    Assignee: Premitec, Inc.
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Patent number: 8396562
    Abstract: A wide-filed retinal prosthesis enables an increased field of vision with a relatively small scleral incision. The retinal prosthesis includes a flexible substrate comprising a central member and at least one wing, with an array of electrodes disposed therein that are configured to stimulate the central and peripheral nerves of the retina.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: March 12, 2013
    Assignee: Doheny Eye Institute
    Inventors: Hossein Ameri, James Weiland, Helmut Eckhard, Stefan Ufer, Tenapat Ratanapakorn, Mark Humayun
  • Patent number: 8285612
    Abstract: Systems and methods are provided for data processing. In one implementation, a data processing system includes storage means for storing sets of account identifiers, each of the sets of account identifiers being assigned a set of control parameters. The data processing system may also include an account management system that stores account data of accounts that are identified by the account identifiers, interface means coupled to the account management system, and one or more sets of application programs that are adapted to process account data of accounts identified by at least one of the one or more sets of account identifiers using the set of control parameters assigned to the at least one of the one or more sets of account identifiers. The interface means may obtain the account data from the account management system on request of one of the application programs.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: October 9, 2012
    Assignee: SAP AG
    Inventors: Chalbia Abdelfattah, Juergen Abt, Dirk Becker, Roger F. Gutbrod, Rolf W. Haas, Juan Puga Ortiz, Martin Schroter, Stefan Ufer, Joerg Wegener, Burkhard H. Weiss
  • Publication number: 20120215282
    Abstract: A wide-filed retinal prosthesis enables an increased field of vision with a relatively small scleral incision. The retinal prosthesis includes a flexible substrate comprising a central member and at least one wing, with an array of electrodes disposed therein that are configured to stimulate the central and peripheral nerves of the retina.
    Type: Application
    Filed: April 30, 2012
    Publication date: August 23, 2012
    Applicant: Doheny Eye Institute
    Inventors: Hossein Ameri, James Weiland, Helmut Eckhard, Stefan Ufer, Tenapat Ratanapakorn, Mark Humayun
  • Patent number: 8190266
    Abstract: A wide-filed retinal prosthesis enables an increased field of vision with a relatively small scleral incision. The retinal prosthesis includes a flexible substrate comprising a central member and at least one wing, with an array of electrodes disposed therein that are configured to stimulate the central and peripheral nerves of the retina.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: May 29, 2012
    Assignee: Dohey Eye Institute
    Inventors: Hossein Ameri, James Weiland, Helmut Eckhard, Stefan Ufer, Tanapat Ratanapakorn, Mark Humayun
  • Publication number: 20120112347
    Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.
    Type: Application
    Filed: October 6, 2011
    Publication date: May 10, 2012
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Patent number: 8173490
    Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: May 8, 2012
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Publication number: 20110117703
    Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
    Type: Application
    Filed: January 18, 2011
    Publication date: May 19, 2011
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Patent number: 7898074
    Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: March 1, 2011
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Publication number: 20100148345
    Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 17, 2010
    Inventors: Helmut Eckhardt, Stefan Ufer
  • Publication number: 20070191909
    Abstract: A wide-filed retinal prosthesis enables an increased field of vision with a relatively small scleral incision. The retinal prosthesis includes a flexible substrate comprising a central member and at least one wing, with an array of electrodes disposed therein that are configured to stimulate the central and peripheral nerves of the retina.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 16, 2007
    Applicant: Doheny Eye Institute
    Inventors: Hossein Ameri, James Weiland, Helmut Eckhard, Stefan Ufer, Tanapat Ratanapakorn, Mark Humayun
  • Patent number: 7171252
    Abstract: Calibration of in vivo oxygen and pH sensor systems can be performed by generating a constituent element of an environment proximate to an in vivo sensor electrode via an in vivo generating electrode and determining a level of the constituent element in the tissue via the in vivo sensor electrode. Accordingly, accurate monitoring of tissue can be achieved while reducing the need to calibrate the in vivo sensor systems using invasive procedures. Related electrode assemblies are also discussed.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: January 30, 2007
    Assignees: Sicel Technologies, Inc., North Carolina State University
    Inventors: Charles W. Scarantino, H. Troy Nagle, Chang-Soo Kim, Stefan Ufer, Jason Fiering, Bahram Ghaffarzadeh Kermani
  • Publication number: 20060178958
    Abstract: Systems and methods are provided for data processing. In one implementation, a data processing system includes storage means for storing sets of account identifiers, each of the sets of account identifiers being assigned a set of control parameters. The data processing system may also include an account management system that stores account data of accounts that are identified by the account identifiers, interface means coupled to the account management system, and one or more sets of application programs that are adapted to process account data of accounts identified by at least one of the one or more sets of account identifiers using the set of control parameters assigned to the at least one of the one or more sets of account identifiers. The interface means may obtain the account data from the account management system on request of one of the application programs.
    Type: Application
    Filed: December 1, 2005
    Publication date: August 10, 2006
    Inventors: Chalbia Abdelfattah, Juergen Abt, Dirk Becker, Roger Gutbrod, Rolf Haas, Juan Ortiz, Martin Schroter, Stefan Ufer, Joerg Wegener, Burkhard Weiss
  • Publication number: 20060006141
    Abstract: Methods for fabricating a plurality of sensors on a flexible substrate, with each sensor having associated electrodes and at least one well include (a) providing a flexible substrate material layer having a surface area defined by a length and width thereof; (b) forming a plurality of sensor elements onto the flexible substrate material layer, each sensor element comprising at least one metallic electrode; (c) disposing at least one coverlay sheet layer over the flexible substrate sandwiching the sensor elements therebetween; (d) laminating the at least one coverlay sheet layer having an associated thickness to the flexible substrate; and (e) removing predetermined regions of the laminated coverlay sheet layer from the flexible substrate laycr to expose a portion of the underlying metallic pattern of each sensor element and to define a well with a depth corresponding to the thickness of the coverlay sheet layer.
    Type: Application
    Filed: November 15, 2002
    Publication date: January 12, 2006
    Inventors: Stefan Ufer, Christopher Wilsey
  • Publication number: 20050236361
    Abstract: Methods for fabricating a plurality of sensors on a flexible substrate, with each sensor having associated electrodes and at least one well include (a) providing a flexible substrate material layer having a surface area defined by a length and width thereof; (b) forming a plurality of sensor elements onto the flexible substrate material layer, each sensor element comprising at least one metallic electrode; (c) disposing at least one coverlay sheet layer over the flexible substrate sandwiching the sensor elements therebetween; (d) laminating the at least one coverlay sheet layer having an associated thickness to the flexible substrate; and (e) removing predetermined regions of the laminated coverlay sheet layer from the flexible substrate layer to expose a portion of the underlying metallic pattern of each sensor element and to define a well with a depth corresponding to the thickness of the coverlay sheet layer.
    Type: Application
    Filed: March 14, 2005
    Publication date: October 27, 2005
    Inventors: Stefan Ufer, Christopher Wilsey
  • Patent number: 6843899
    Abstract: Chemical sensors include a flexible substrate, a flexible lower electrode on the flexible substrate, and a patterned flexible dielectric layer on the flexible lower electrode opposite the flexible substrate. A patterned flexible upper electrode also is included on the patterned flexible dielectric layer opposite the flexible lower electrode. The patterned flexible dielectric layer and the patterned flexible upper electrode are patterned to establish a first current flow path between the flexible lower electrode and the patterned flexible upper electrode through the chemical, if present, upon application of voltage between the flexible lower electrode and the patterned flexible upper electrode. The flexible lower electrode also may be patterned to establish a second current flow path between portions of the patterned flexible lower electrode through the chemical, if present, upon application of voltage between the portions of the patterned flexible lower electrodes.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: January 18, 2005
    Assignee: North Carolina State University
    Inventor: Stefan Ufer