Patents by Inventor Stefan Uwe Schindler

Stefan Uwe Schindler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-mold for a microphone assembly and method of producing the same
    Patent number: 9986354
    Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: May 29, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thomas Mueller, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl, Jochen Dangelmaier
  • Lead frame based MEMS sensor structure
    Patent number: 9346667
    Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: May 24, 2016
    Assignee: Infineon Technologies AG
    Inventors: Cyrus Ghahremani, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl
  • LEAD FRAME BASED MEMS SENSOR STRUCTURE
    Publication number: 20150344294
    Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 3, 2015
    Applicant: Infineon Technologies AG
    Inventors: Cyrus Ghahremani, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl
  • Pre-mold for a microphone assembly and method of producing the same
    Publication number: 20150001646
    Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 1, 2015
    Inventors: Thomas MUELLER, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl, Jochen Dangelmaier