Patents by Inventor Stefanie E. Harvey

Stefanie E. Harvey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monopolar electrostatic chuck having an electrode in contact with a workpiece
    Patent number: 5982607
    Abstract: A monopolar electrostatic chuck having a conductive pedestal base with a dielectric layer deposited thereupon. Upon the top surface of the dielectric layer is deposited a wafer spacing mask fabricated from a conduction material. The wafer spacing mask contains a plurality of support members that support a workpiece in a spaced apart relation with respect to said dielectric layer. At least one of said support members in said plurality of support members is adapted for connection to a power supply. The chucking voltage power supply is connected between the conductive pedestal base and the wafer support mask. In this manner, the workpiece is attracted to and thereby retained on the chuck without a plasma being generated proximate the wafer.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: November 9, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Vincent E. Burkhart, Stefanie E. Harvey
  • Monopolar electrostatic chuck having an electrode in contact with a workpiece
    Patent number: 5745332
    Abstract: A monopolar electrostatic chuck having a conductive pedestal base with a dielectric layer deposited thereupon. Upon the top surface of the dielectric layer is deposited a wafer spacing mask fabricated from a conduction material. The wafer spacing mask contains a plurality of support members that support a workpiece in a spaced apart relation with respect to said dielectric layer. At least one of said support members in said plurality of support members is adapted for connection to a power supply. The chucking voltage power supply is connected between the conductive pedestal base and the wafer support mask. In this manner, the workpiece is attracted to and thereby retained on the chuck without a plasma being generated proximate the wafer.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: April 28, 1998
    Assignee: Applied Materials, Inc.
    Inventors: Vincent E. Burkhart, Stefanie E. Harvey