Abstract: The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition: from 40 to 90 wt. % of i) at least one ethylenically unsaturated non-ionic monomer; from 1 to 30 wt. % of ii) non-polymerizable electrolyte; from 0.1 to 10 wt. % of iii) at least one radical generating thermal initiator; from 0 to 20 wt. % of iv) filler; and, from 0 to 20 wt. % of v) toughener.

Abstract: The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

Abstract: The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

Abstract: The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; and, a solubilizer.

Abstract: The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.

Abstract: The present invention is directed to a curable and debondable two-part (2K) hybrid adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) (meth)acrylate monomer; c) an electrolyte; d) a solubilizer; and e) a filler; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; b) an accelerator; and, c) a filler.