Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: A control system an unmanned vehicle includes a first processing unit configured to execute a primary autopilot process for controlling the unmanned vehicle. The control system further includes a programmable logic array in operative communication with the first processing unit. The control system also includes a state machine configured in the programmable logic array. The state machine is configured to enable control of the unmanned vehicle according to a backup autopilot process in response to an invalid output of the first processing unit.

Abstract: A processing system for an unmanned vehicle (UV) such as an unmanned aerial vehicle (UAV) is provided. The processing system comprises a first processing unit of an integrated circuit and a second processing unit of the integrated circuit. The processing system comprises a first operating system provisioned using the first processing unit. The first operating system is configured to execute a first vehicle control process. The processing system comprises a virtualization layer configured using at least the second processing unit, and a second operating system provisioned using the virtualization layer. The second operating system is configured to execute a second vehicle control process.

Abstract: A system-on-module (SOM) for controlling an unmanned vehicle (UV) is provided. The SOM comprises a circuit board, a first processing system in operative communication with the circuit board, and a second processing system in operative communication with the circuit board. The first processing system includes one or more first processing units and a volatile programmable logic array. The first processing system is configured to execute a first process for the UV. The second processing system includes one or more second processing units and a non-volatile programmable logic array. The second processing system is configured to monitor execution of the first process by the first processing system.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: A processing system for an unmanned vehicle (UV) such as an unmanned aerial vehicle (UAV) is provided. The processing system comprises a first processing unit of an integrated circuit and a second processing unit of the integrated circuit. The processing system comprises a first operating system provisioned using the first processing unit. The first operating system is configured to execute a first vehicle control process. The processing system comprises a virtualization layer configured using at least the second processing unit, and a second operating system provisioned using the virtualization layer. The second operating system is configured to execute a second vehicle control process.

Abstract: A control system an unmanned vehicle includes a first processing unit configured to execute a primary autopilot process for controlling the unmanned vehicle. The control system further includes a programmable logic array in operative communication with the first processing unit. The control system also includes a state machine configured in the programmable logic array. The state machine is configured to enable control of the unmanned vehicle according to a backup autopilot process in response to an invalid output of the first processing unit.

Abstract: A control system an unmanned vehicle includes a first processing unit configured to execute a primary autopilot process for controlling the unmanned vehicle. The control system further includes a programmable logic array in operative communication with the first processing unit. The control system also includes a state machine configured in the programmable logic array. The state machine is configured to enable control of the unmanned vehicle according to a backup autopilot process in response to an invalid output of the first processing unit.

Abstract: A system-on-module (SOM) for controlling an unmanned vehicle (UV) is provided. The SOM comprises a circuit board, a first processing system in operative communication with the circuit board, and a second processing system in operative communication with the circuit board. The first processing system includes one or more first processing units and a volatile programmable logic array. The first processing system is configured to execute a first process for the UV. The second processing system includes one or more second processing units and a non-volatile programmable logic array. The second processing system is configured to monitor execution of the first process by the first processing system.

Abstract: A processing system for an unmanned vehicle (UV) such as an unmanned aerial vehicle (UAV) is provided. The processing system comprises a first processing unit of an integrated circuit and a second processing unit of the integrated circuit. The processing system comprises a first operating system provisioned using the first processing unit. The first operating system is configured to execute a first vehicle control process. The processing system comprises a virtualization layer configured using at least the second processing unit, and a second operating system provisioned using the virtualization layer. The second operating system is configured to execute a second vehicle control process.

Abstract: A control system for an unmanned vehicle (UV) comprises a housing defining an interior, a first circuit board disposed within the interior, and a second circuit board disposed within the interior. The first circuit board includes one or more processing circuits including a first processing system and a second processing system having heterogeneous field programmable architectures. The second circuit board includes a plurality of interface circuits associated with a plurality of vehicle devices of the UV. The second circuit board is in operative communication with the first circuit board and includes an input/output (I/O) interface between the plurality of interface circuits and the first and second processing systems.

Abstract: A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the cover, the stiffener including an outer frame and at least one cross-member. The control box further includes a heat sink removably connected in contact with the stiffener. The control box further includes a first circuit board disposed within the interior, the first circuit board positioned between the stiffener and the heat sink, and a second circuit board disposed within the interior, the second circuit board positioned between the cover and the stiffener. The cover, stiffener, and heat sink are stacked along a transverse direction.

Abstract: A system-on-module (SOM) for controlling an unmanned vehicle (UV) is provided. The SOM comprises a circuit board, a first processing system in operative communication with the circuit board, and a second processing system in operative communication with the circuit board. The first processing system includes one or more first processing units and a volatile programmable logic array. The first processing system is configured to execute a first process for the UV. The second processing system includes one or more second processing units and a non-volatile programmable logic array. The second processing system is configured to monitor execution of the first process by the first processing system.

Abstract: A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: A control box includes a housing defining an interior, a circuit board disposed within the interior, and an input/output connector extending from the housing. The control box further includes a heat sink removably connected to the housing such that the circuit board is positioned between the housing and the heat sink. The circuit board is in contact with the heat sink.

Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.