Abstract: An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.

Abstract: A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.

Abstract: A method of testing a semiconductor device having a DC line configured to carry either a DC signal or a DC voltage and a circuit electrically connected to the DC line includes: during a first part of a test sequence, enabling a switch device so as to electrically connect a capacitor to the DC line via the switch device and applying a test signal to the circuit while the capacitor is electrically connected to the DC line; and during a second part of the test sequence, disabling the switch device so as to electrically disconnect the capacitor from the DC line via the switch device, injecting an AC signal onto the DC line after the capacitor is electrically disconnected from the DC line, and measuring a response of the circuit to the AC signal.

Abstract: A system may include a first power detector to measure a power level of a signal on a first transmitter channel, a second power detector to measure a power level of a signal on a second transmitter channel. The system may include a combiner to provide a combined signal associated with the signal on the first transmitter channel and the signal on the second transmitter channel, and a third power detector to measure a power level of the combined signal. The system may include a processing circuit to determine a relative phase difference between the signal on the first transmitter channel and the signal on the second transmitter channel based on results of measuring the power level of the signal on the first transmitter channel, measuring the power level of the signal on the second transmitter channel, and measuring the power level of the combined signal.

Abstract: A method of testing a semiconductor device having a DC line configured to carry either a DC signal or a DC voltage and a circuit electrically connected to the DC line includes: during a first part of a test sequence, enabling a switch device so as to electrically connect a capacitor to the DC line via the switch device and applying a test signal to the circuit while the capacitor is electrically connected to the DC line; and during a second part of the test sequence, disabling the switch device so as to electrically disconnect the capacitor from the DC line via the switch device, injecting an AC signal onto the DC line after the capacitor is electrically disconnected from the DC line, and measuring a response of the circuit to the AC signal.