Abstract: A milk liner of a milking apparatus has a resiliently deformable sleeve extending between a mouthpiece and an outlet pipe. The sleeve forms a cavity for receiving a teat of an animal to be milked. The sleeve incudes a first portion having a plurality of ribs, where the ribs extend longitudinally along and transversally outward from the first portion. The longitudinal extent of each rib terminates at a proximal end of the first portion. The transversal extent of each rib terminates in a flange for engaging with a shell. A second portion is located between a proximal end of the first portion and the outlet pipe. Both portions are configured to sequentially and progressively collapse inwards, where the progressive inward collapse is directed towards the distal end of the sleeve when a pressure difference is within a predetermined range, resulting in a peristaltic massage directed upward of the teat.

Abstract: A method for forming a package of plastic material for a semiconductor electronic device having heat sink fully embedded within the package plastic case, is of the type which provides for forming the plastic case within a mold on whose interior a heat sink has been placed which has a first major surface to be insulated by means of a plastic material layer with a first thickness, whereon a metal leadframe and at least one semiconductor material die having an electronic circuit formed thereon have been fixed, and a second major surface opposite from the first and to be insulated by means of a plastic material layer with a second thickness, thinner than said first thickness; and at least one supporting element adapted to be positioned inside the mold cavity facilitating properly spacing the second surface of the heat sink out from a facing wall of the mold cavity during the process of introducing the plastic material for molding.

Abstract: DNA strands having the ability to biotechnologically produce glycerol-3-phosphate acyltransferase (ATase) useful for converting the property of the PG of membrane lipids into that of more chilling resistance, specifically a chimeric gene of glycerol-3-phosphate acyltransferase (ATase) cDNA derived from squash in which the about one-third central region (the site cleaved by Kpn I and Hind III) has been replaced with the corresponding region of spinach ATase cDNA, a cDNA derived from squash in which the about one-sixth central region (the site cleaved by Hind III and Sac I) has been replaced with the corresponding region of spinach ATase cDNA, or a chimeric gene of ATase cDNA derived from spinach in which the about one-third 3'-terminal region (the site cleaved by Kpn I and Eco RI) has been replaced with the corresponding region of squash ATase cDNA are disclosed.These chimeric genes can express a chimeric ATase which has a higher substrate selectivity to unsaturated fatty acids.

Abstract: A method for forming a plastic package for a power semiconductor electronic device to be encapsulated within a plastic case and to be coupled thermally to a heat sink element having a major surface exposed and at least one peripheral portion extending outwards from at least one side of the plastic case. The method forms the plastic case of the package by molding inside a main cavity of a mold after positioning a heat sink element in a suitable housing provided in a lower portion of the mold which opens into the main cavity of the mold. The method forms the heat sink element such that at least side surfaces jutting out of said side of the plastic case are, at least in a zone adjacent to that side and in the peripheral portion, inclined to form an angle .alpha. substantially greater than zero with a normal line to the major surface, so as to have a negative slope from outside.

Abstract: A method for forming a package of plastic material for a semiconductor electronic device having heat sink fully embedded within the package plastic case, is of the type which provides for forming the plastic case within a mold on whose interior a heat sink has been placed which has a first major surface to be insulated by means of a plastic material layer with a first thickness, whereon a metal leadframe and at least one semiconductor material die having an electronic circuit formed thereon have been fixed, and a second major surface opposite from the first and to be insulated by means of a plastic material layer with a second thickness, thinner than said first thickness; and at least one supporting element adapted to be positioned inside the mold cavity facilitating properly spacing the second surface of the heat sink out from a facing wall of the mold cavity during the process of introducing the plastic material for molding.