Abstract: A method and system are provided for converting wind power into electrical energy. One or more blades are attached by one or more struts to a vertical or central shaft, wherein each strut mechanically couples at least one of the blades to the shaft. One or more blades may be laminar. An optional method of fabricating a wind turbine blade, or fluid turbine blade, wherein the blade may be manufactured by a pultrusion process; may present a constant blade twist along a central axis of the blade itself; and/or may present a cross-section along the blade central axis. Alternatively or additionally, an airfoil is provided may be laminar and/or uncambered. According to a still additional optional aspect of the method of the present invention, a Darrieus-type vertical-axis wind turbine is provided, the turbine having a shaft that defines a rotation axis with a plurality of substantially rigid blades.

Abstract: A method and system are provided for converting wind power into electrical energy. One or more blades are attached by one or more struts to a vertical or central shaft, wherein each strut mechanically couples at least one of the blades to the shaft. One or more blades may be laminar. An optional method of fabricating a wind turbine blade, or fluid turbine blade, wherein the blade may be manufactured by a pultrusion process; may present a constant blade twist along a central axis of the blade itself; and/or may present a cross-section along the blade central axis. Alternatively or additionally, an airfoil is provided may be laminar and/or uncambered. According to a still additional optional aspect of the method of the present invention, a Darrieus-type vertical-axis wind turbine is provided, the turbine having a shaft that defines a rotation axis with a plurality of substantially rigid blades.

Abstract: Vertical axis wind turbines and Savonius blades incorporating an internal conduit for diverting a portion of an airflow incident on the blades are disclosed.

Abstract: The present invention discloses methods and apparatuses for substrate singulation. Embodiments of the present invention comprise cryogenic-assist scribing or cutting mechanism for debris reduction, preferably cryogenic-assist laser scribe or cutting; controlling mechanism for debris flow and redeposition during laser process; and integrated, dry debris removal scribing process with breaking mechanism. An exemplary embodiment comprises an integrated housing for aligning a laser beam with the cryogenic cleaning beam. The integrated housing is preferably made of low thermal conductivity material to provide a high temperature gradient between the low temperature of the cryogenic fluid and the ambient temperature, preventing condensation of the moisture. The entire areas, or the critical areas of the apparatus can also be purged with flowing “dry” inert gases to further reduce the condensation moisture. Reactive gas can be introduced to react with debris, converting into gaseous form for ease of removal.

Abstract: A plasma processing device (25) including a vacuum chamber (27) for processing a substrate (29) and a source chamber (26) for generating a plasma is disclosed where the source chamber (26) has a non-cylindrical geometry. Helicon waves of plasma are propagated from the source chamber into the vacuum chamber by a magnetic field having substantially parallel magnetic field lines extending from the source chamber into the vacuum chamber. A RF antenna (31 and 32) of a novel serpentine configuration is used to couple electromagnetic energy into the source chamber to create helicon plasma waves in the source chamber (26). The non-cylindrical geometry of the source chamber allows the processing of large area substrates due to the ability to scale the source chamber to the desired application while maintaining throughput efficiency and the ability to propagate helicon waves along the magnetic field lines present in the source chamber.

Abstract: A vacuum processing chamber having a substrate support removably mounted therein. The chamber includes an opening in a sidewall thereof and the opening is large enough to allow the substrate support to be removed from the chamber through the opening. A modular mounting arrangement extends through the opening and removably supports the substrate support in the interior of the chamber at a position located inwardly of an inner sidewall of the chamber. The mounting arrangement includes a mounting flange and a support arm. The mounting flange is attached to an exterior surface of the chamber and the support arm extends between the substrate support and the mounting flange. The chamber includes a single vacuum port in a central portion of an endwall of the chamber spaced from the substrate support. The vacuum port is connected to a vacuum pump which removes gases from the interior of the chamber and maintains the chamber at a pressure below atmospheric pressure.

Abstract: A vacuum processing chamber having a substrate support removably mounted therein. The chamber includes an opening in a sidewall thereof and the opening is large enough to allow the substrate support to be removed from the chamber through the opening. A modular mounting arrangement extends through the opening and removably supports the substrate support in the interior of the chamber at a position located inwardly of an inner sidewall of the chamber. The mounting arrangement includes a mounting flange and a support arm. The mounting flange is attached to an exterior surface of the chamber and the support arm extends between the substrate support and the mounting flange. The chamber includes a single vacuum port in a central portion of an endwall of the chamber spaced from the substrate support. The vacuum port is connected to a vacuum pump which removes gases from the interior of the chamber and maintains the chamber at a pressure below atmospheric pressure.