Abstract: The invention relates to a monolithic structure in composite material manufactured starting from a fiber-reinforced prepreg material and comprises two walls facing each other and at least one interconnection element extending transversely between the walls, connected to them and delimiting with the latter respective elongated cavities; wherein the walls extend symmetrically at opposite sides of a direction; the interconnection element is a rib extending transversely to the aforesaid direction; at least one wall has a sandwich configuration and comprises two panels facing each other and at least one spar member, which extends transversely between the panels, is connected to them, delimits with the latter respective elongated cavities and extends transversally to the rib.

Abstract: An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed.

Abstract: An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed.