Abstract: A method to manufacture an electronic device (1) to be applied to rubber article. The device comprises (i) an electronic element (5, 6, 7), (ii) a covering element made of one or more layers (3) of thermoplastic material and arranged to cover said electronic element (5, 6, 7), and (iii) at least a rubber layer (4) arranged to cover at least part of an outer surface (3a) of the covering element. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least part of one outer surface (3a) of said covering element; and (b) a heating operation, during which the part of the outer surface of the covering element on which the adhesive solution was applied is kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.

Abstract: A method to manufacture an electronic device (1) to be applied to rubber article. The device comprises (i) an electronic element (5, 6, 7), (ii) a covering element made of one or more layers (3) of thermoplastic material and arranged to cover said electronic element (5, 6, 7), and (iii) at least a rubber layer (4) arranged to cover at least part of an outer surface (3a) of the covering element. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least part of one outer surface (3a) of said covering element; and (b) a heating operation, during which the part of the outer surface of the covering element on which the adhesive solution was applied is kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.