Abstract: An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a plurality of n-type and p-type subregions disposed on the single die to separate the transmitter region from the receiver region. The pn-junctions between the n-type and p-type subregions are reverse-biased thereby reducing or eliminating coupling of noise and crosstalk between the transmitter and receiver is reduced.

Abstract: A transmitter uses an on-chip pattern generator to provide an input signal, and a built-in monitor to detect the power of the light emitted by the light source. The transmitter determines the correlation between the output power measured by an external power meter, and the output power detected by the built-in monitor. After the correlation is determined, the external power meter is no longer needed. Instead, further characterizations, such as over-temperature characterizations, are performed by determining the power detected by the built-in monitor, and then using the known correlation to calculate the actual power output and other transmitter characteristics.

Abstract: An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a plurality of n-type and p-type subregions disposed on the single die to separate the transmitter region from the receiver region. The pn-junctions between the n-type and p-type subregions are reverse-biased thereby reducing or eliminating coupling of noise and crosstalk between the transmitter and receiver is reduced.

Abstract: An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a plurality of n-type and p-type subregions disposed on the single die to separate the transmitter region from the receiver region. The pn-junctions between the n-type and p-type subregions are reverse-biased thereby reducing or eliminating coupling of noise and crosstalk between the transmitter and receiver is reduced.

Abstract: An optical transceiver includes a main body that serves as the heat sink for the optical transceiver. A wafer-level package is attached to a first face of the main body. The wafer-level package contains at least one optoelectronic device such as a light-emitting device or a light detector. An alignment element is attached to the wafer-level package for aligning an optical fiber to the optoelectronic device. A fiber receptacle is attached to the main body for holding the optical fiber securely. One or more auxiliary components can be attached to a second face of the main body. An optional cover can be attached to the main body to cover and protect the auxiliary components. A flexible circuit is made of a pliable material and is attached to the main body. The flexible circuit electrically couples the auxiliary components and the wafer-level package.

Abstract: An optical receiver system includes an amplifier circuit and a compensation circuit. The amplifier circuit includes a light detector, and a transimpedance amplifier. The transimpedance amplifier produces an amplified signal. The compensation circuit includes at least one pole compensation stage that performs pole compensation on the amplified signal.

Abstract: An optical transceiver includes a main body that serves as the heat sink for the optical transceiver. A wafer-level package is attached to a first face of the main body. The wafer-level package contains at least one optoelectronic device such as a light-emitting device or a light detector. An alignment element is attached to the wafer-level package for aligning an optical fiber to the optoelectronic device. A fiber receptacle is attached to the main body for holding the optical fiber securely. One or more auxiliary components can be attached to a second face of the main body. An optional cover can be attached to the main body to cover and protect the auxiliary components. A flexible circuit is made of a pliable material and is attached to the main body. The flexible circuit electrically couples the auxiliary components and the wafer-level package.

Abstract: A communications system includes a transceiver and a host board. The transceiver includes an interrupt request terminal and a communication port. The host board includes an interrupt request line and a communication bus, wherein the interrupt request line is coupled to the interrupt request terminal to receive an interrupt request, and the communication bus is coupled to the communication port to receive data.

Abstract: A transmitter uses an on-chip pattern generator to provide an input signal, and a built-in monitor to detect the power of the light emitted by the light source. The transmitter determines the correlation between the output power measured by an external power meter, and the output power detected by the built-in monitor. After the correlation is determined, the external power meter is no longer needed. Instead, further characterizations, such as over-temperature characterizations, are performed by determining the power detected by the built-in monitor, and then using the known correlation to calculate the actual power output and other transmitter characteristics.

Abstract: An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a plurality of n-type and p-type subregions disposed on the single die to separate the transmitter region from the receiver region. The pn-junctions between the n-type and p-type subregions are reverse-biased thereby reducing or eliminating coupling of noise and crosstalk between the transmitter and receiver is reduced.