Patents by Inventor Stefano VERZURA

Stefano VERZURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9647313
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 9, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Franco Marconi, Fabio Morgia, Haiou Gou, Stefano Verzura, Guoyu Su
  • Publication number: 20140327490
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement (101) comprising a first conductive layer (103), a second conductive layer (105) and a dielectric layer (107), wherein the first conductive layer (103) is arranged on the dielectric layer (107), and wherein the dielectric layer (107) is arranged on the second conductive layer (105), wherein the first conductive layer (103) comprises a microwave circuit (109) and wherein the second conductive layer (105) forms a reference potential layer, a hollow microwave waveguide (111) being at least partly formed in the second conductive layer (105), and a microwave transition structure (113) for electromagnetically coupling the first conductive layer (103) with the hollow microwave waveguide (111). According to some implementation forms, a reflector on a cover covering the multilayer arrangement (101) may be avoided.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: Franco MARCONI, Fabio MORGIA, Haiou GOU, Stefano VERZURA, Guoyu SU