Patents by Inventor Steffen Ebenau

Steffen Ebenau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structured adhesive layer
    Patent number: 10100227
    Abstract: The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: October 16, 2018
    Assignee: tesa SE
    Inventors: Nils Thebud, Steffen Ebenau
  • Grooved adhesive tape
    Patent number: 9676967
    Abstract: The aim of the invention is to improve an impairment to the adherence of an adhesive tape to a substrate caused by the inclusion of air bubbles between the adhesive tape and the substrate. According to the invention, said aim is achieved by means of an adhesive tape which comprises at least one adhesive layer, wherein the adhesive layer has at least one groove and none of the grooves extends as far as one of the lateral edges of the adhesive layer. The invention further relates to a release liner having a surface which has at least one ridge, wherein none of the ridges extends as far as one of the lateral edges of the release liner.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: June 13, 2017
    Assignee: TESA SE
    Inventors: Steffen Ebenau, Nils Thebud
  • GROOVED ADHESIVE TAPE
    Publication number: 20150225612
    Abstract: The aim of the invention is to improve an impairment to the adherence of an adhesive tape to a substrate caused by the inclusion of air bubbles between the adhesive tape and the substrate. According to the invention, said aim is achieved by means of an adhesive tape which comprises at least one adhesive layer, wherein the adhesive layer has at least one groove and none of the grooves extends as far as one of the lateral edges of the adhesive layer. The invention further relates to a release liner having a surface which has at least one ridge, wherein none of the ridges extends as far as one of the lateral edges of the release liner.
    Type: Application
    Filed: August 1, 2013
    Publication date: August 13, 2015
    Applicant: TESA SE
    Inventors: Steffen Ebenau, Nils Thebud
  • STRUCTURED ADHESIVE LAYER
    Publication number: 20150218423
    Abstract: The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%.
    Type: Application
    Filed: August 29, 2013
    Publication date: August 6, 2015
    Applicant: TESA SE
    Inventors: Nils Thebud, Steffen Ebenau