Abstract: A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.

Abstract: A package includes an electronic component, an inorganic encapsulant encapsulating at least part of the electronic component, and an adhesion promoter between at least part of the electronic component and the encapsulant.

Abstract: A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.

Abstract: A package includes an electronic component, an inorganic encapsulant encapsulating at least part of the electronic component, and an adhesion promoter between at least part of the electronic component and the encapsulant.

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

Abstract: The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

Abstract: The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.

Abstract: A compressed-air compressor for producing compressed air for a compressed-air system of a vehicle includes a cylinder and a piston. The piston is arranged in the cylinder and divides the interior space of the cylinder into a compression chamber, which can be connected to the compressed-air system of the vehicle for the purpose of conveying compressed air, and a neutral chamber. The neutral chamber is charged with an auxiliary pressure such that the pressure in the neutral chamber is temporally on average higher than atmospheric pressure. The compressed air production using the piston/cylinder-type compressed-air compressor is improved such that the maximum value of the torque to be imparted for driving the compressor is reduced.

Abstract: A compressor system for a compressed-air supply arrangement includes an adjustable throttle device arranged in the suction line of the compressor. The throttle device is adjustable between a fully open load position and an idle position with a predefined narrowed throttle cross section. The idle power of the compressor is reduced as a result of the reduction of the pressure level downstream of the throttle device without additional lines, filters or the like.

Abstract: A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.

Abstract: The invention relates to an air compressor having a catalyst that is disposed in a reception block. The reception block is interposed between a valve block and a cylinder cover, comprises an inlet port in the region of a valve block outlet port, and an outlet port in the region of a cylinder head inlet port, so the compressed air exiting the valve block outlet port flows through said catalyst and through the outlet port into the cylinder cover.

Abstract: A compressed-air compressor for producing compressed air for a compressed-air system of a vehicle includes a cylinder and a piston. The piston is arranged in the cylinder and divides the interior space of the cylinder into a compression chamber, which can be connected to the compressed-air system of the vehicle for the purpose of conveying compressed air, and a neutral chamber. The neutral chamber is charged with an auxiliary pressure such that the pressure in the neutral chamber is temporally on average higher than atmospheric pressure. The compressed air production by means of the piston/cylinder-type compressed-air compressor is improved such that the maximum value of the torque to be imparted for driving the compressor is reduced.

Abstract: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

Abstract: The present invention relates to a device for operating an auxiliary assembly (16), comprising a housing (14), of a vehicle, in particular of a utility vehicle, having a drive unit (12) which comprises a further housing (18) and has the purpose of making available a torque, a shaft (30) for transmitting the torque from the drive unit (12) to the auxiliary assembly (16), wherein the shaft (30) projects into the housing (14) of the auxiliary assembly (16) or into the further housing (18) of the drive unit (12). Furthermore, the drive unit (12) and the auxiliary assembly (16) form a common coolant circuit (52) for cooling the drive unit (12) and the auxiliary assembly (16).

Abstract: The invention relates to an air compressor having a catalyst that is disposed in a reception block. The reception block is interposed between a valve block and a cylinder cover, comprises an inlet port in the region of a valve block outlet port, and an outlet port in the region of a cylinder head inlet port, so the compressed air exiting the valve block outlet port flows through said catalyst and through the outlet port into the cylinder cover.

Abstract: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.