Abstract: A computed tomography device includes a gantry with a supporting gantry part and a rotor. The rotor has a projection data acquisition system and an energy store configured to supply energy to the projection data acquisition system. The rotor is rotatably mounted relative to the supporting gantry part. The gantry has an energy transmission system configured for energy transmission from the supporting gantry part to the energy store of the rotor, wherein the rotor is configured to be at rest relative to the supporting gantry part during the energy transmission from the supporting gantry part to the energy store of the rotor.

Abstract: A processing facility for manufacturing integrated circuits on semiconductor wafers is provided with at least one radiation generator that generates an EUV (extreme ultraviolet) radiation that is supplied to at least one lithography machine, housed in a factory building, for exposure of the semiconductor wafers. The radiation generator is housed in a building or a building section separate from the factory building. At least one beam guide extends from the building or the building section to the factory building, wherein the EUV radiation is supplied from the building or the building section through the at least one beam guide to the factory building. At least one supply line branches off at an obtuse angle from the at least one beam guide inside the factory building, wherein at least a portion of the EUV radiation is supplied through the at least one supply line to the lithography machine.

Abstract: A processing facility for manufacturing integrated circuits on semiconductor wafers is provided with at least one radiation generator that generates an EUV (extreme ultraviolet) radiation that is supplied to at least one lithography machine, housed in a factory building, for exposure of the semiconductor wafers. The radiation generator is housed in a building or a building section separate from the factory building. At least one beam guide extends from the building or the building section to the factory building, wherein the EUV radiation is supplied from the building or the building section through the at least one beam guide to the factory building. At least one supply line branches off at an obtuse angle from the at least one beam guide inside the factory building, wherein at least a portion of the EUV radiation is supplied through the at least one supply line to the lithography machine.

Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Abstract: An example embodiment includes a system for communicating an optical signal. The system includes an optical transmitter and an optical receiver. The optical transmitter includes one or more lasers configured to produce a light signal and a transmitter optical sub assembly (TOSA) receptacle. The TOSA receptacle optically couples the lasers to an optical fiber and launches a quasi-multimode optical signal (quasi-MM signal) that includes at least one lower order mode optical signal and at least one higher order mode optical signal onto the optical fiber. The optical receiver is connected to the optical fiber via a receiver optical sub assembly (ROSA) receptacle. The optical receiver is configured to receive the quasi-MM signal and to substantially block the at least one higher order mode optical signal.

Abstract: In the case of a process for the manufacture of contact strips, in particular for electrolyzers (membrane cells), the objective is to provide a solution that allows to create a cheap but also extremely efficient method for the manufacture of such contact strips at a high electrical efficiency. This objective is achieved by applying the roll bonding method to attach a copper strip to a titanium strip.

Abstract: Methods of improving the quality of by-products or residues derived from starch-containing material in a processes for producing fermentation products including adding an enzyme composition comprising an enzyme or a mixture of enzymes capable of degrading one or more fermented mash components to fermented mash; and separating fermentation product.

Abstract: An example embodiment includes a system for communicating an optical signal. The system includes an optical transmitter and an optical receiver. The optical transmitter includes one or more lasers configured to produce a light signal and a transmitter optical sub assembly (TOSA) receptacle. The TOSA receptacle optically couples the lasers to an optical fiber and launches a quasi-multimode optical signal (quasi-MM signal) that includes at least one lower order mode optical signal and at least one higher order mode optical signal onto the optical fiber. The optical receiver is connected to the optical fiber via a receiver optical sub assembly (ROSA) receptacle. The optical receiver is configured to receive the quasi-MM signal and to substantially block the at least one higher order mode optical signal.

Abstract: The present disclosure relates to an improved process of producing a fermentation product, in particular ethanol. The present disclosure relates also to the use of enzymes for improving the quality of by-products in the fermentative production process and to compositions comprising enzymes capable of degrading components in the fermented mash in the fermentation process.

Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: The present disclosure relates to an improved process of producing a fermentation product, in particular ethanol. The present disclosure relates also to the use of enzymes for improving the quality of by-products in the fermentative production process and to compositions comprising enzymes capable of degrading components in the fermented mash in the fermentation process.

Abstract: An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Abstract: An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.

Abstract: A chip arrangement for an optoelectronic component includes at least one semiconductor chip which emits electromagnetic radiation, and a connection arrangement which includes planes that are electrically insulated from one another, at least one plane having a cavity and at least one plane being a heat dissipating plane, wherein at least two electrically insulated conductors are arranged in at least the two planes, the semiconductor chip is arranged within the cavity and has at least two connection locations, and each of the connection locations is electrically conductively connected to a respective one of the conductors.

Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.