Abstract: An end effector for clamping a slab formed substrate (2) having a rim section (5) that is arranged at least approximately and at least partially in a substrate main plane comprises at least a pressing device (10) providing at least a pressing area (11), and at least a support device (20) providing at least a support area (21). The end effector (1) is configured, in a clamped state of the substrate (2), to clamp the substrate (2) at a first surface (3) by a pressing area (11) of a pressing device (10) and at a second surface (4) that is, in regard to the first surface (3), arranged at the opposite side of the substrate (2) by a support area (21) of a support device (20). The end effector comprises a guide (15) for guiding the pressing device (10) relative to the support device (20).

Abstract: An interface device for a purging unit for purging a wafer container with a purging gas, which comprises a contact piece for contacting a purging interface of a wafer container, wherein the contact piece is movably arranged in the purging unit and has a gas passage in its interior. A corresponding interface device is provided. The object is to specify an interface device which, when the wafer container is coupled to the purging unit, makes it possible to seal a gas inlet or a gas outlet, to introduce or to discharge a purging gas into the wafer container, thereby compensating for and adapting to vertical and horizontal movements, preventing wear, and fulfilling a passive coupling and sealing function as well as offering maximum durability and reliability. This is achieved by a contact piece which is suspended directly or indirectly in the purging unit by means of a spring device.

Abstract: An end effector for clamping a slab formed substrate (2) having a rim section (5) that is arranged at least approximately and at least partially in a substrate main plane comprises at least a pressing device (10) providing at least a pressing area (11), and at least a support device (20) providing at least a support area (21). The end effector (1) is configured, in a clamped state of the substrate (2), to clamp the substrate (2) at a first surface (3) by a pressing area (11) of a pressing device (10) and at a second surface (4) that is, in regard to the first surface (3), arranged at the opposite side of the substrate (2) by a support area (21) of a support device (20). The end effector comprises a guide (15) for guiding the pressing device (10) relative to the support device (20).

Abstract: An interface device for a purging unit for purging a wafer container with a purging gas, which comprises a contact piece for contacting a purging interface of a wafer container, wherein the contact piece is movably arranged in the purging unit and has a gas passage in its interior. A corresponding interface device is provided. The object is to specify an interface device which, when the wafer container is coupled to the purging unit, makes it possible to seal a gas inlet or a gas outlet, to introduce or to discharge a purging gas into the wafer container, thereby compensating for and adapting to vertical and horizontal movements, preventing wear, and fulfilling a passive coupling and sealing function as well as offering maximum durability and reliability. This is achieved by a contact piece which is suspended directly or indirectly in the purging unit by means of a spring device.

Abstract: An apparatus for manipulating articles in which a multiaxial industrial robot is arranged on a travel unit and the industrial robot and the travel unit can be supplied with electrical energy via an energy storage unit. The travel unit has a control unit and at least three wheels having at least one drive unit, with the control unit being configured to rotate at least one of the wheels by the drive unit about an axis of rotation standing perpendicular on a symmetrical axis of rotation of the wheel and to rotate it about the symmetrical axis of rotation by the respective drive unit so that the apparatus can be moved in any direction by the travel unit. In addition, area monitoring sensors are arranged on at least two sides of the travel unit to monitor a virtual surface located at a predefined spacing next to and not intersecting the travel unit.

Abstract: The present invention relates to an apparatus for manipulating articles in which a multiaxial industrial robot (1) is arranged on a travel unit (2) and the industrial robot (1) and the travel unit (2) can be supplied with electrical energy via an energy storage unit (4). The travel unit (2) has a control unit (23) and at least three wheels (5) having at least one drive unit (6), wherein the control unit (23) is configured to rotate at least one of the wheels (5) by the drive unit (6) about an axis of rotation standing perpendicular on a symmetrical axis of rotation (7) of the wheel (5) and to rotate it about the symmetrical axis of rotation (7) by the respective drive unit (6) so that the apparatus is travelable in any directions by the travel unit (2). In addition, area monitoring sensors (11) are arranged at at least two sides of the travel unit (2).

Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.

Abstract: An apparatus and a method for the removal of pellicles from masks which can be used for photolithographic purposes. The pellicles are removed from masks in a universal manner without them being further contaminated or damaged. In an apparatus, at least one grip is present for the manipulation of masks provided with pellicles which has at least two fixing elements which engage at the edge of a mask with exerted pressure force. There are moreover present in this connection at least one detector for the contactless determination of the position of mounts formed at the radially outer edge of pellicles, and a heating device for the heating of an adhesive with which pellicles are fastened to a mask with material continuity, and a removal apparatus of the pellicles from a mask having a mask fixing unit and a pellicle removal unit.

Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.

Abstract: An apparatus and a method for the removal of pellicles from masks which can be used for photolithographic purposes. The pellicles are removed from masks in a universal manner without them being further contaminated or damaged. In an apparatus, at least one grip is present for the manipulation of masks provided with pellicles which has at least two fixing elements which engage at the edge of a mask with exerted pressure force. There are moreover present in this connection at least one detector for the contactless determination of the position of mounts formed at the radially outer edge of pellicles, and a heating device for the heating of an adhesive with which pellicles are fastened to a mask with material continuity, and a removal apparatus of the pellicles from a mask having a mask fixing unit and a pellicle removal unit.

Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.

Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.

Abstract: The invention relates to an apparatus for transporting and aligning disk-shaped elements in particular wafers which have to be removed from the processing devices and transported to further processing devices and inserted therein during the manufacturing process as a result of technologic unemployment, and which have to be removed again after processing. Such an apparatus should be simply and solidly built, and which can be produced at a reasonable price and which is versatile. On the apparatus a carriage is arranged on a rotatable carriage support. The carriage support can be laterally moved. In addition, a holder for a disk-shaped element is guided for alignment with the rotation axis of the carriage support and through the latter. The carriage and/or carriage support and the holder as well are movable relative to each other in the vertical direction, and at least one detector for determining the location of markers existing on a disk-shaped element is arranged on the carriage support.