Patents by Inventor Stephan Bandermann

Stephan Bandermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component
    Patent number: 11536594
    Abstract: A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: December 27, 2022
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Jürgen Rietsch, Andreas Plach, Stephan Bandermann, Thomas Schmidt, Andreas Albert, Klaus Scharrer, Bernd Seitz, Jens mEnke
  • SENSOR COMPONENT, PRE-ASSEMBLY ARRANGEMENT FOR A SENSOR COMPONENT, AND METHOD FOR PRODUCING A SENSOR COMPONENT
    Publication number: 20200191619
    Abstract: A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: Vitesco Technologies Germany GMBH
    Inventors: Jürgen Rietsch, Andreas Plach, Stephan Bandermann, Thomas Schmidt, Andreas Albert, Klaus Scharrer, Bernd Seitz, Jens mENKE