Abstract: A self-inflating tire assembly includes an air tube mounted within a tire sidewall groove. The air tube is in contacting engagement with opposite angled groove surfaces surrounding the air tube. A segment of the air tube is flattened from an expanded diameter to a flat diameter by bending and compression of the groove in a rolling tire footprint to force air evacuated from the flattened segment along a tube air passageway. The sidewall groove extends into an annular, axially extending, sidewall surface such as an axially oriented surface of a tire chafer protrusion located in non-contacting relationship with the rim. The air tube is extruded from a rubber composition, the rubber composition comprising: a diene based rubber; from 0.

Abstract: A dual band transponder comprises a carrier substrate having at least one planar substrate layer. An ultra-high frequency loop antenna is mounted on a first surface of one of the planar substrate layers of the carrier substrate. A high frequency loop antenna is mounted on two opposite surfaces of one of the planar substrate layers of the carrier substrate. The ultra-high frequency loop antenna encloses the high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely. A textile label includes a textile label substrate and a corresponding dual band transponder mounted onto the textile label substrate.

Abstract: A dual band transponder comprises a carrier substrate having at least one planar substrate layer. An ultra-high frequency loop antenna is mounted on a first surface of one of the planar substrate layers of the carrier substrate. A high frequency loop antenna is mounted on two opposite surfaces of one of the planar substrate layers of the carrier substrate. The ultra-high frequency loop antenna encloses the high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely. A textile label includes a textile label substrate and a corresponding dual band transponder mounted onto the textile label substrate.

Abstract: A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.

Abstract: A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.

Abstract: A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.

Abstract: A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.

Abstract: A fall detection device (10) which comprises two identical housings (11), each containing an identical pressure sensor (12) housed within a suitable recess (13) of the corresponding housing (11). The housings (11) are mounted on a printed circuit (14) using electrical connection pins (15). The two sensors (12) are arranged coaxially head to foot and communicate directly with the ambient air in order to output a measurement of the atmospheric pressure value. The sensors are arranged so as to generate a signal based on the measurements utilized for detecting a fall, and comprise a unit for transmitting the signal to a transmission station as an alarm signal.