Abstract: A substrate includes a first surface area; and a second surface area with a second roughness value. In a height profile of the substrate along a cutting line crossing the first surface area and the second surface area, a height of the substrate along a first section of the height profile is larger than the height of the substrate along a second section of the height profile. In the height profile an absolute value of a height difference between a point of maximum height or an averaged height, respectively, of the second section and a point of minimal height or an averaged height, respectively, of the first section defines a depth value. A ratio of the depth value and the second roughness value is between 2 and 35. A marking element extends across the first surface area and the second surface area.

Abstract: The present disclosure relates to a method for non-destructive inspection of a structure, preferably a through-glass via, TGV, of a substrate, preferably a glass substrate, comprising the steps of: applying a moldable mass onto a surface of the structure of the substrate; hardening of the moldable mass so that the mass is elastic; non-destructive removing of the elastic mass from the structure; and analyzing the removed elastic mass according to at least one parameter, preferably a quality parameter.

Abstract: The present disclosure relates to a thin glass for an optical component that includes a first side with a first surface and a second side opposite the first side with a second surface. The thin glass has a three-dimensional shape with at least one target curvature and a thickness of less than 700 ?m. On at least one first measurement area of 3×3 mm2 of the first surface, all surface structure components in a wavelength range of 0.1 mm to 1 mm have an arithmetical mean height Sa of below 30 nm, below 20 nm, below 10 nm, or below 8 nm. On the first measurement area, all surface structure components in a wavelength range from 0.1 mm to 1 mm can have an arithmetical mean height Sa of between 1 nm and 30 nm, between 3 nm and 20 nm, or between 6 nm and 10 nm. The values for the arithmetical mean height refer to a measurement by means of white light interferometry, with a bandpass filtering of 0.1 mm to 1 mm, i.e. with a bandpass filtering for viewing surface structure components in wavelength ranges from 0.

Abstract: A substrate includes a first surface area; and a second surface area with a second roughness value. In a height profile of the substrate along a cutting line crossing the first surface area and the second surface area, a height of the substrate along a first section of the height profile is larger than the height of the substrate along a second section of the height profile. In the height profile an absolute value of a height difference between a point of maximum height or an averaged height, respectively, of the second section and a point of minimal height or an averaged height, respectively, of the first section defines a depth value. A ratio of the depth value and the second roughness value is between 2 and 35. A marking element extends across the first surface area and the second surface area.

Abstract: Substrates of glass or glass ceramic are disclosed which are coated with decorations, also methods for preparing such coatings are disclosed, wherein the decorations are optimized with respect to their acoustic characteristics in such a way that in particular when displacing cookware on induction cooking surfaces the subjective noise feeling is minimized, as possible.

Abstract: A method for the production of protection devices is provided. The method includes the step of providing a tile package. The provision of the tile package includes the steps of: laminating at least one board of a tile material onto a polymer foil; scoring the board on the side which is opposite to the polymer foil; and fracturing the board along the scoring lines for achieving a plurality of tiles which are fixed on the polymer foil.

Abstract: A method for the production of protection devices is provided. The method includes the step of providing a tile package. The provision of the tile package includes the steps of: laminating at least one board of a tile material onto a polymer foil; scoring the board on the side which is opposite to the polymer foil; and fracturing the board along the scoring lines for achieving a plurality of tiles which are fixed on the polymer foil.