Patents by Inventor Stephan Eicher

Stephan Eicher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production of a multi-chip component
    Patent number: 10886145
    Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: January 5, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Michael Zitzlsperger, Tobias Gebuhr, Stephan Eicher
  • Carrier substrate for an optoelectronic semiconductor component
    Patent number: 10632655
    Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: April 28, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Stephan Eicher, Martin Brandl, Markus Boss
  • PRODUCTION OF A MULTI-CHIP COMPONENT
    Publication number: 20190035972
    Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.
    Type: Application
    Filed: January 26, 2017
    Publication date: January 31, 2019
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Michael ZITZLSPERGER, Tobias GEBUHR, Stephan EICHER
  • CARRIER SUBSTRATE FOR AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
    Publication number: 20190009441
    Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.
    Type: Application
    Filed: August 11, 2016
    Publication date: January 10, 2019
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Eicher, Martin Brandl, Markus Boss