Abstract: A heat sink is disclosed including a cold plate, a plurality of heat pipes, a plurality of fins, and a heating unit. The cold plate has a first surface adapted to thermally couple to a heat source. Each of the heat pipes has an evaporator section thermally coupled to the cold plate and a condenser section coupled to the evaporator section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes. The heating unit is adapted to heat condenser sections of a subset of the plurality of heat pipes.

Abstract: A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged substantially vertical and thermally coupled to the cold plate, a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes.

Abstract: A method and apparatus for actively cooling a device, space or circuit board are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid in a closed loop, at least two heat exchangers and a fluid driver.

Abstract: A thin-plate microchannel structure of channel depth of 500 microns or less and capable of withstanding pressure up to 6,000 psi inch is disclosed. The thin-plate microchannel structure may be formed from metal, ceramic or polymeric materials. It can be employed to facilitate the exchange of heat between a single fluid in liquid, gaseous or supercritical state and another device, such as an integrated circuit, with which it is near or in contact.

Abstract: Methods and apparatuses for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger. At least two configurations are disclosed: one with a pump and another without a pump.