Abstract: The method according to the invention consists in providing a wafer having a bottom layer, a top first sacrificial layer and an insulating layer, structuring the first sacrificial layer to form a three dimensional structure onto which a first structural layer is deposited to define a corresponding three dimensional structure on the bottom surface of the first structural layer. The method consists also in forming a second three dimensional structure on the upper surface of the first structural layer.

Abstract: The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.

Abstract: The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.

Abstract: Silicon microcarriers suitable for fluorescent assays as a well as a method of producing such microcarriers are provided. The method includes the steps of providing a SOI wafer having a bottom layer of monocristalline silicone, an insulator layer and a bottom layer of monocristalline silicon, delineating microparticles, etching away the insulator layer and then depositing an oxide layer on the wafer still holding the microparticles before finally lifting-off the microparticles.

Abstract: The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.

Abstract: The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.

Abstract: The method according to the invention consists in providing a wafer having a bottom layer, a top first sacrificial layer and an insulating layer, structuring the first sacrificial layer to form a three dimensional structure onto which a first structural layer is deposited to define a corresponding three dimensional structure on the bottom surface of the first structural layer. The method consists also in forming a second three dimensional structure on the upper surface of the first structural layer.

Abstract: Silicon microcarriers suitable for fluorescent assays as a well as a method of producing such microcarriers are provided. The method includes the steps of providing a SOI wafer having a bottom layer of monocristalline silicone, an insulator layer and a bottom layer of monocristalline silicon, delineating microparticles, etching away the insulator layer and then depositing an oxide layer on the wafer still holding the microparticles before finally lifting-off the microparticles.

Abstract: Flow regulator for the infusion of medicaments, comprising, in succession, a substrate (1), a channel (5), a spacer (3) and a membrane (4), the latter having at least one hole (6) communicating with the channel (5), characterized in that the regulator is produced from at least two separate elements (1-4), the first element comprising the membrane (4) and the second element comprising the spacer (3).

Abstract: The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).

Abstract: The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).

Abstract: The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).

Abstract: The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).