Patents by Inventor Stephan I. Braye

Stephan I. Braye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions and Methods for the Electrodeposition of Nanotwinned Copper
    Publication number: 20240110306
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
  • Compositions and methods for the electrodeposition of nanotwinned copper
    Patent number: 11873568
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 16, 2024
    Assignee: MacDermid Enthone Inc.
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
  • Compositions and Methods for the Electrodeposition of Nanotwinned Copper
    Publication number: 20220298665
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Application
    Filed: June 7, 2022
    Publication date: September 22, 2022
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
  • Compositions and methods for the electrodeposition of nanotwinned copper
    Patent number: 11384446
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: July 12, 2022
    Assignee: MacDermid Enthone Inc.
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
  • Compositions and Methods for the Electrodeposition of Nanotwinned Copper
    Publication number: 20220064812
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar