Abstract: A method for inhibiting whisker growth on a metallic substrate susceptible to whisker growth (e.g., tin, zinc, cadmium, indium, silver, lead, aluminum, gold, aluminum, gold, and alloys thereof), the method comprising coating a surface of the metallic substrate with a charge dissipative (CD) polymer, or more particularly, an electrostatically dissipative (ESD) polymer, that inhibits whisker growth on said surface under conditions where whisker growth would otherwise occur. In some embodiments, the CD or ESD polymer does not possess the necessary strength and/or thickness to function as a physical barrier for whisker growth. In particular embodiments, the CD or ESD polymer prevents the onset of whisker formation or growth, thus not requiring the CD or ESD polymer to function as a physical barrier.

Abstract: A method for inhibiting whisker growth on a metallic substrate susceptible to whisker growth (e.g., tin, zinc, cadmium, indium, silver, lead, aluminum, gold, aluminum, gold, and alloys thereof), the method comprising coating a surface of the metallic substrate with a charge dissipative (CD) polymer, or more particularly, an electrostatically dissipative (ESD) polymer, that inhibits whisker growth on said surface under conditions where whisker growth would otherwise occur. In some embodiments, the CD or ESD polymer does not possess the necessary strength and/or thickness to function as a physical barrier for whisker growth. In particular embodiments, the CD or ESD polymer prevents the onset of whisker formation or growth, thus not requiring the CD or ESD polymer to function as a physical barrier.

Abstract: A clamping system is provided for effectively securing at least one power device in a thermally-conductive and electrically-insulative manner to a heatsink with a clamp member having an elongated member portion adapted to bear against a device, and a second member portion having an end adapted to bear against a heatsink. A fastener exerts a force on the member between the device and the second member portion to force an end of the second member portion into contact with the heatsink, and cause the member portion overlying the device to reciprocally exert a pressure on the device against the heatsink.