Abstract: A method of obstructing metal whisker growth that includes providing a conductive structure comprised of a whisker forming metal, and forming a composite coating on the whisker forming metal. The composite coating may include a matrix phase of a polymer and a dispersed phase of reinforcing particles. The reinforcing particles are incorporated into the polymer to provide the composite coating with mechanical properties that obstruct whiskers from penetrating through the composite coating.

Abstract: A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is adjusted to juxtapose its "lower" surface with the "upper" surface of the components to be heat-sunk. A heat-transfer pad (318) may be used between the heatsink adapter (410) and the component (18a). In various embodiments, the heatsink adapter takes the form of circular (410) or rectangular (410R) plugs, a draw-tube (808) arrangement, or a bellows (1010).