Patents by Inventor Stephan JOOS

Stephan JOOS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a circuit board system
    Patent number: 9706637
    Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: July 11, 2017
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Guenther Kraft, Stephan Joos, Krunoslav Orcic, Walter Knappich, Didier Berthomier
  • METHOD FOR PRODUCING A CIRCUIT BOARD SYSTEM AND A CIRCUIT BOARD ARRANGEMENT
    Publication number: 20140063748
    Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.
    Type: Application
    Filed: August 22, 2013
    Publication date: March 6, 2014
    Applicant: Harman Becker Automotive Systems GmbH
    Inventors: Guenther KRAFT, Stephan JOOS, Krunoslav ORCIC, Walter KNAPPICH, Didier BERTHOMIER