Abstract: A device for dosing solid and/or liquid substances includes a container to hold solid and/or liquid substances in an interior space of the container. The container has at least one side wall, at least one base wall, and at least one outlet opening. The device also includes a dosing unit to dose solid and/or liquid substances contained in the container from the outlet opening, and a sensor arranged in the exterior space to detect electromagnetic radiation. The sensor is located in a region above the base wall and opposite a transparent part of the side wall. The device is configured to enable an empty signal from the device's container to be detected more reliably and a drink to be completely dosed, even upon receiving an empty signal. A beverage maker and a method are additionally provided.

Abstract: A beverage maker with controllable operation includes: a brewing unit, a storage container for at least one beverage; at least one detection unit for detecting a fill level in the storage container; a quantity of beverage brewed in the brewing unit and/or a quantity of beverage consumed by the user; an evaluation unit which communicates with the at least one detection unit and is configured such that it evaluates the data transmitted by the detection unit and determines therefrom the quantity of new beverage to be brewed; and a control unit for controlling the quantity of beverage to be brewed in the brewing unit to the desired filling quantity in the storage container based on the evaluation result of the evaluation unit.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.