Abstract: An electronic system, an apparatus for cooling an electronic system, an electronics cooling apparatus, and associated method use a clutch to operate a cooling fan. An electronics cooling fan for usage in cooling an electronic system comprises a clutch that disengages upon failure wherein the electronics cooling fan is configured to freewheel upon disengagement of the clutch.

Abstract: An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Abstract: An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.

Abstract: A power supply comprises a chassis, a plurality of alternating current (AC) power receptacles formed into the chassis, and power supply circuit contained within the chassis and selectively coupled to ones of the plurality of AC power receptacles.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).

Abstract: A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.

Abstract: An assembly comprises a frame configured to mount an electronic device and assemble to a heat sink. The assembly further comprises at least one self-locking fastener adapted to lock into place and secure the heat sink to the frame on aligned compression of the heat sink toward the framed.

Abstract: A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.

Abstract: An assembly comprises a voltage regulator module and a field-pluggable voltage converter module configured in an arrangement that interlocks with and optionally attaches to the voltage regulator module.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.

Abstract: The apparatus and method may have the following: a spring element that pivots about a pivot axis; a flexible mount coupled to the spring element such that the pivot axis of the spring element is constrained; and at least one portion of the spring element contacting a heat sink, the spring element in combination with the flexible mount deforming to apply a controlled load to the heat sink.

Abstract: A shroud for interacting with a circuit component defining a component surface having an array of pins extending from the component surface. The shroud includes a planar member defining an array of apertures complimenting the array of the pins. The planar member is configured to interact with the circuit component to maintain uniform contact between the pins and a corresponding socket.

Abstract: A heat dissipation apparatus comprising a base and a plurality of fins connected to the base and extending out from the base at a non-orthogonal angle to the base.

Abstract: An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.

Abstract: One embodiment of the invention includes a method for preventing a plurality of electronic devices from being pulled out of an equipment rack simultaneously. The method includes determining with an electronic sensor module whether an electronic device of a plurality of electronic devices coupled to the equipment rack is being slid out of the equipment rack. Provided the electronic device is being slid out of the equipment rack, an electronic locking module prevents any remaining electronic device of the plurality of electronic devices from being slid out of the equipment rack. A determination is made as to whether the electronic device has been slid back into the equipment rack. Provided the electronic device has been slid back into the equipment rack, the prevention is deactivated.

Abstract: A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.