Abstract: Disclosed is an optical fiber having a core with an alkali metal oxide dopant in an peak amount greater than about 0.002 wt. % and less than about 0.1 wt. %. The alkali metal oxide concentration varies with a radius of the optical fiber. By appropriately selecting the concentration of alkali metal oxide dopant in the core and the cladding, a low loss optical fiber may be obtained. Also disclosed are several methods of making the optical fiber including the steps of forming an alkali metal oxide-doped rod, and adding additional glass to form a draw perform. Preferably, the draw preform has a final outer dimension (d2), wherein an outer dimension (d1) of the rod is less than or equal to 0.06 times the final outer dimension (d2). In a preferred embodiment, the alkali metal oxide-doped rod is inserted into the centerline hole of a preform to form an assembly.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.

Abstract: A method is provided for sealing one or more fill holes (42, 44) in a glass plate (14) of an organic dye solar cell and other glass packages by covering the hole(s) (42, 44) with a laser absorbing glass patch (52, 54). The outer perimeter of the glass patch (52, 54) is melted with a laser such that the outer perimeter of the glass patch (52, 54) is hermetically sealed to the glass plate (14). Another method is provided in which the fill holes (42, 44) are covered with a glass patch (52, 54) having a loop of absorbing frit around the outer periphery thereof. The loop of frit is melted with a laser such that the outer perimeter of the glass patch (52, 54) is hermetically sealed to the glass plate (14).

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A method of minimizing localized heating of, or minimizing signal losses across a source of loss in, an optical fiber used in transmission of a high power optical signal at an operating wavelength. These methods include the steps of: providing an optical fiber which comprises either (i) a coating characterized by an absorbance of less than about 4.5 dB/cm at the operating wavelength or (ii) a refractive index lower than the refractive index of a cladding layer of the optical fiber by more than about 3×10?3 at the operating wavelength, or (iii) both (i) and (ii); and transmitting a optical signal having a power greater than about 250 mW through the optical fiber, wherein the coating, cladding layer, or combination thereof are selected to minimize localized heating of the optical fiber or to result in a signal loss across a source of loss that is less than about 250 mW at the operating wavelength.

Abstract: The invention provides an ultraviolet lithography method/system. The lithography method and system include providing a below 200 nm radiation source, providing a photolytically improved transmitting fused silica glass lithography optical element, transmitting below 200 nm photons through said photolytically improved transmitting fused silica glass lithography optical element to form a lithography pattern which is reduced and projected onto a radiation sensitive lithography printing medium to form a printed lithography pattern. Providing the photolytically improved transmitting fused silica glass lithography optical element includes providing a photolytically improved transmitting fused silica glass lithography optical element preform body and forming the photolytically improved transmitting fused silica glass lithography optical element preform into said lithography optical element.

Abstract: The invention provides an ultraviolet lithography method/system. The lithography method and system include providing a below 200 nm radiation source, providing a photolytically improved transmitting fused silica glass lithography optical element, transmitting below 200 nm photons through said photolytically improved transmitting fused silica glass lithography optical element to form a lithography pattern which is reduced and projected onto a radiation sensitive lithography printing medium to form a printed lithography pattern. Providing the photolytically improved transmitting fused silica glass lithography optical element includes providing a photolytically improved transmitting fused silica glass lithography optical element preform body and forming the photolytically improved transmitting fused silica glass lithography optical element preform into said lithography optical element.

Abstract: Glasses in the Ca—Al—Si system are useful in forming optical components for use in telecommunication systems. The glasses include, in mole percent: SiO2 present in an amount of about 6 to about 60 percent, Ga2O3, Al2O3, or a combination thereof present in an amount of about 12 to about 31 percent, and CaO present in an amount of about 20 to about 65 percent.

Abstract: A bridge fiber and a method of connecting two other dissimilar optical waveguide fibers is presented. The bridge fiber may be utilized to connect positive dispersion fibers or step index single mode fibers to compensative fibers, such as dispersion compensation fibers or dispersion-slope compensation fibers.

Abstract: Glasses in the Ca—Al—Si system are useful in forming optical components for use in telecommunication systems. The glasses include, in mole percent: SiO2 present in an amount of about 6 to about 60 percent, Ga2O3, Al2O3, or a combination thereof present in an amount of about 12 to about 31 percent, and CaO present in an amount of about 20 to about 65 percent.

Abstract: A bridge fiber and a method of connecting two other dissimilar optical waveguide fibers is presented. The bridge fiber may be utilized to connect positive dispersion fibers or step index single mode fibers to compensative fibers, such as dispersion compensation fibers or dispersion-slope compensation fibers.

Abstract: An optical signal limiter is provided for limiting transmission of a continuous wave optical signal that exceeds a preselected threshold power level. The limiter includes a body having input and output ends that is formed at least in part from a material having a negative thermal index coefficient of between about −0.5×10−4 °C.−1 and −4.0×10−4 °C.−1 and an absorption coefficient of between 1.0 to 5.0 dB/cm at wavelengths between 980-1650 nm. The limiter also includes collimating fibers mounted on the input and output ends to minimize low power signal losses across the limiter body. It may be installed at a junction between two optical fibers and is preferably formed from a curable adhesive having the aforementioned negative thermal index coefficient to obviate the need for separate bonding materials and joining steps during the installation of the limiter.

Abstract: An optical signal limiter is provided for limiting transmission of a continuous wave optical signal that exceeds a preselected threshold power level. The limiter includes a body having input and output ends that is formed at least in part from a material having a negative thermal index coefficient of between about −0.5×10−4° C.−1 and −4.0×10−4 ° C.1 and an absorption coefficient of between 1.0 to 5.0 dB/cm at wavelengths between 980-1650 nm. The limiter also includes collimating fibers mounted on the input and output ends to minimize low power signal losses across the limiter body. It may be installed at a junction between two optical fibers and is preferably formed from a curable adhesive having the aforementioned negative thermal index coefficient to obviate the need for separate bonding materials and joining steps during the installation of the limiter.

Abstract: An accelerated radiation damage testing method for an optical sample includes disposing the optical sample inside or external to an optical cavity and injecting a predetermined number of light pulses into the optical cavity at a selected wavelength and at spaced intervals. Each light pulse injected into the optical cavity produces a train of pulses which are focused on the optical sample. The method further includes allowing each light pulse in the optical cavity to decay to a selected value and determining a change in a selected optical property of the optical sample after the optical sample has been exposed to a predetermined number of pulses.

Abstract: The invention provides an ultraviolet lithography method/system. The lithography method and system include providing a below 200 nm radiation source, providing a photolytically improved transmitting fused silica glass lithography optical element, transmitting below 200 nm photons through said photolytically improved transmitting fused silica glass lithography optical element to form a lithography pattern which is reduced and projected onto a radiation sensitive lithography printing medium to form a printed lithography pattern. Providing the photolytically improved transmitting fused silica glass lithography optical element includes providing a photolytically improved transmitting fused silica glass lithography optical element preform body and forming the photolytically improved transmitting fused silica glass lithography optical element preform into said lithography optical element.