Abstract: Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

Abstract: A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption ? which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength ? over the frit at a speed greater than about 5 mm/s, and wherein ?·h at ? is between 0.4 and about 1.

Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.

Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed through a mask to create an elongated beam having a length-wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width-wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length-wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.

Abstract: A method of minimizing localized heating of, or minimizing signal losses across a source of loss in, an optical fiber used in transmission of a high power optical signal at an operating wavelength. These methods include the steps of: providing an optical fiber which comprises either (i) a coating characterized by an absorbance of less than about 4.5 dB/cm at the operating wavelength or (ii) a refractive index lower than the refractive index of a cladding layer of the optical fiber by more than about 3×10?3 at the operating wavelength, or (iii) both (i) and (ii); and transmitting a optical signal having a power greater than about 250 mW through the optical fiber, wherein the coating, cladding layer, or combination thereof are selected to minimize localized heating of the optical fiber or to result in a signal loss across a source of loss that is less than about 250 mW at the operating wavelength.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.

Abstract: Disclosed is an optical fiber having a core with an alkali metal oxide dopant in an peak amount greater than about 0.002 wt. % and less than about 0.1 wt. %. The alkali metal oxide concentration varies with a radius of the optical fiber. By appropriately selecting the concentration of alkali metal oxide dopant in the core and the cladding, a low loss optical fiber may be obtained. Also disclosed are several methods of making the optical fiber including the steps of forming an alkali metal oxide-doped rod, and adding additional glass to form a draw perform. Preferably, the draw preform has a final outer dimension (d2), wherein an outer dimension (d1) of the rod is less than or equal to 0.06 times the final outer dimension (d2). In a preferred embodiment, the alkali metal oxide-doped rod is inserted into the centerline hole of a preform to form an assembly.