Patents by Inventor Stephan Preuss
Stephan Preuss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220024460Abstract: A computer-implemented method for configuring one or more systems related to the operation of a vehicle includes: in response to receiving input data indicative of a user being about to initiate an operation of the vehicle: determining an identity of the user, loading first data representative of one or more mapping rules from a first memory device, selecting and loading second data representative of one or more generic settings from a second memory device, wherein selecting the data is based on the identity of the user, transforming, based on the mapping rules, the generic settings into vehicle-specific settings, and configuring, based on the vehicle-specific settings, the one or more systems related to the operation of the vehicle.Type: ApplicationFiled: July 22, 2021Publication date: January 27, 2022Inventors: Stephan PREUSS, Carolin Andrea CAPARELLI, Nicolas Olivier Sébastien VILLIERS
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Publication number: 20210099849Abstract: An emergency system (100, 200) for a vehicle comprising a data collection unit (101) for recording emergency data, wherein the emergency data comprise at least vehicle data (110) and the medical data (120) of at least one user of the vehicle, a data storage unit (140) for storing the emergency data, and a data access unit (150) by means of which a communication link (182) can be established to the data storage unit (140).Type: ApplicationFiled: September 23, 2020Publication date: April 1, 2021Applicant: Herman Becker Automotive Systems GmbHInventors: Richard Zoidl, Anilkumar Hariharakrishnan, Stephan Preuss
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Publication number: 20210095983Abstract: A method and a system for reducing the environmental pollution due to a transport route, wherein the transport route contains at least one transport means, a transport material, and a route, is characterized in that an environmental account is provided, on which environmental units are managed, in that a transport route causes costs in the form of a number of environmental units and these costs are deducted from the environmental account, and in that a transport route is selected in dependence on the costs.Type: ApplicationFiled: September 23, 2020Publication date: April 1, 2021Applicant: Harman Becker Automotive Systems GmbHInventors: Stephan Preuss, Anilkumar Hariharakrishnan, Richard Zoidl
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Patent number: 10851441Abstract: A plug-in connector and a semi-finished product include a strip of an aluminum alloy and at least one bonding layer of a copper/tin alloy electrolytically applied directly onto the aluminum alloy strip. The bonding layer has a thickness of at most 50 nm. A further metal layer or alloy layer is applied onto the bonding layer.Type: GrantFiled: December 29, 2017Date of Patent: December 1, 2020Assignee: Diehl Metal Applications GmbHInventors: Uwe Zeigmeister, Christian Buchholzer, Andre Stein, Stephan Preuss, Martin Wunderlich, Sandra Correia
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Publication number: 20180119253Abstract: A plug-in connector and a semi-finished product include a strip of an aluminum alloy and at least one bonding layer of a copper/tin alloy electrolytically applied directly onto the aluminum alloy strip. The bonding layer has a thickness of at most 50 nm. A further metal layer or alloy layer is applied onto the bonding layer.Type: ApplicationFiled: December 29, 2017Publication date: May 3, 2018Inventors: UWE ZEIGMEISTER, CHRISTIAN BUCHHOLZER, ANDRE STEIN, STEPHAN PREUSS, MARTIN WUNDERLICH, SANDRA CORREIA
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Patent number: 9761512Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.Type: GrantFiled: March 11, 2015Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuss, Michael Zitzlsperger
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Patent number: 9366395Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.Type: GrantFiled: May 23, 2012Date of Patent: June 14, 2016Assignee: OSRAM Opto Semiconductors GmbHInventors: Kirstin Petersen, Stephan Preuss, Markus Pindl, Markus Boss, Martin Brandl
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Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device
Publication number: 20150333232Abstract: A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.Type: ApplicationFiled: December 17, 2013Publication date: November 19, 2015Inventors: Stephan Preuß, Michael Zitzlsperger, Caroline Kistner -
Publication number: 20150187685Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.Type: ApplicationFiled: March 11, 2015Publication date: July 2, 2015Inventors: Stephan Preuss, Michael Zitzlsperger
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Patent number: 9012951Abstract: A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer.Type: GrantFiled: August 9, 2011Date of Patent: April 21, 2015Assignee: OSRAM Opto Semiconductors GmbHInventor: Stephan Preuss
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Patent number: 8790939Abstract: A method for producing a plurality of radiation-emitting components includes A) providing a carrier layer having a plurality of mounting regions separated from one another by separating regions; B) applying an interlayer to the separating regions; C) applying a respective radiation-emitting device to each of the plurality of mounting regions; D) applying a continuous potting layer to the radiation-emitting device and the separating regions; E) severing the potting layer and partially severing the interlayer in the separating regions of the carrier layer in a first separating step; and F) partially severing the interlayer and severing the carrier layer in a second separating step, wherein the interlayer is completely severed by the first and the second separating step.Type: GrantFiled: February 19, 2009Date of Patent: July 29, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuss, Harald Jaeger
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Publication number: 20140168988Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.Type: ApplicationFiled: May 23, 2012Publication date: June 19, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Kirstin Petersen, Stephan Preuss, Markus Pindl, Markus Boss, Martin Brandl
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Patent number: 8748201Abstract: A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.Type: GrantFiled: July 20, 2011Date of Patent: June 10, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuss, Thomas Bemmerl
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Publication number: 20130334558Abstract: A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.Type: ApplicationFiled: December 7, 2011Publication date: December 19, 2013Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Markus Pindl, Harald Jäger, Stephan Preuss, Herbert Brunner
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Publication number: 20130228799Abstract: A method of producing a silicone foil for use in an optoelectronic semiconductor component by molding including introducing a mold foil into a mold, introducing a carrier foil into the mold, wherein the carrier foil is fitted on a substrate foil and the substrate foil projects laterally beyond the carrier foil at least in places within a cavity of the mold, providing and applying a silicone base composition to the mold foil or to the carrier foil, molding the silicone base composition for the silicone foil in the mold between the mold foil and the carrier foil, wherein the silicone base composition is brought into contact with the substrate foil in at least one overlap region laterally alongside the carrier foil, removing the mold foil from the silicone foil, and separating the overlap region.Type: ApplicationFiled: August 17, 2011Publication date: September 5, 2013Applicant: Osram Opto Semiconductors GmbHInventors: Stephan Preuss, Tobias Geltl, Thomas Schiller, Hans-Christoph Gallmeier
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Publication number: 20130210181Abstract: A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.Type: ApplicationFiled: July 20, 2011Publication date: August 15, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuss, Thomas Bemmerl
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Publication number: 20130200417Abstract: A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer.Type: ApplicationFiled: August 9, 2011Publication date: August 8, 2013Applicant: OSRAM Opto Semiconductors GmbHInventor: Stephan Preuss
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Publication number: 20130113010Abstract: An optoelectronic component comprising an optoelectronic semiconductor chip (104) having a contact side (106) and a radiation coupling-out side (108) situated opposite; a chip carrier (102), on which the semiconductor chip (104) is applied via its contact side (106); a radiation conversion element (110) applied on the radiation coupling-out side (108); and a reflective potting compound (112), which is applied on the chip carrier (102) and laterally encloses the semiconductor chip (104) and the radiation conversion element (110); wherein the potting compound (112) adjoins an upper edge of the radiation conversion element (110) in a substantially flush fashion, such that a top side of the radiation conversion element (110) is free of the potting compound (112).Type: ApplicationFiled: April 11, 2011Publication date: May 9, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Herbert Brunner, Hans-Christoph Gallmeier, Simon Jerebic, Stephan Preuss, Hansjörg Schöll
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Publication number: 20120126279Abstract: An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip.Type: ApplicationFiled: May 5, 2010Publication date: May 24, 2012Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Stephan Preuss, Michael Zitzlsperger
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Publication number: 20110127564Abstract: A method for producing a plurality of radiation-emitting components includes A) providing a carrier layer having a plurality of mounting regions separated from one another by separating regions; B) applying an interlayer to the separating regions; C) applying a respective radiation-emitting device to each of the plurality of mounting regions; D) applying a continuous potting layer to the radiation-emitting device and the separating regions; E) severing the potting layer and partially severing the interlayer in the separating regions of the carrier layer in a first separating step; and F) partially severing the interlayer and severing the carrier layer in a second separating step, wherein the interlayer is completely severed by the first and the second separating step.Type: ApplicationFiled: February 19, 2009Publication date: June 2, 2011Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Stephan Preuss, Harald Jaeger