Abstract: A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

Abstract: In accordance with various embodiments, a circuit arrangement may include a first circuit, which is designed for contactless communication, and a second circuit, which is designed in accordance with a predefined functionality. The circuit arrangement may further include at least one electronic component which in a first operating mode together with the first circuit implements the contactless communication and in a second operating mode together with the second circuit implements the predefined functionality.

Abstract: According to one embodiment, a chip card is described including a chip, an antenna, a coupling structure configured to transmit energy from the antenna to the chip and a control element configured to control, depending on a field strength of a magnetic field to which the chip card is exposed, at least one of the resonance frequency of the antenna, the quality factor of the antenna and an energy transmission efficiency of the coupling structure.

Abstract: Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-coated prepreg layer.