Abstract: Carrier module (1) for at least one semiconductor element (3) having a passively and/or actively cooled carrier (4) which has a positive carrier contact (5) and a negative carrier contact (6), with a device (2) for bridging the at least one semiconductor element (3) arranged on the carrier (4), comprising at least one first printed circuit board (7) with at least one bridging element (8), wherein at least one positive contact (9) which is electrically conductively connected to the positive carrier contact (5) and at least one negative contact (11) which is electrically conductively connected to the negative carrier contact (6) are provided on a first printed circuit board (7) and the bridging element (8) is electrically conductively connected to the positive contact (9) and to the negative contact (11) of the first printed circuit board (7), wherein the first printed circuit board (7) is thermally conductively and releasably connected to the carrier (4).

Abstract: The invention relates to a method and an apparatus (1) for the production of a welding seam or a three-dimensional structure (26) on a surface of a metallic work piece (14) with the help of a welding torch (7) for carrying out a welding process with a welding wire (9) guided in a welding torch (7), whereby an electric arc (13) is ignited between the welding wire (9) and the work piece (14), and for stabilizing the electric arc (13) a laser (27?) for emitting a laser beam (27) with a maximum power of 2000 W is arranged, with a point of impact being on that position of the work piece (14) where the welding seam or structure (26) is produced. An improvement of the stabilization of the electric arc (13) is obtained if the laser (27?) is connected to a means (28) for the control of the laser (27?), which control means (28) is designed to activate the laser beam (27) prior to the ignition of the electric arc (13).

Abstract: Carrier module (1) for at least one semiconductor element (3) having a passively and/or actively cooled carrier (4) which has a positive carrier contact (5) and a negative carrier contact (6), with a device (2) for bridging the at least one semiconductor element (3) arranged on the carrier (4), comprising at least one first printed circuit board (7) with at least one bridging element (8), wherein at least one positive contact (9) which is electrically conductively connected to the positive carrier contact (5) and at least one negative contact (11) which is electrically conductively connected to the negative carrier contact (6) are provided on a first printed circuit board (7) and the bridging element (8) is electrically conductively connected to the positive contact (9) and to the negative contact (11) of the first printed circuit board (7), wherein the first printed circuit board (7) is thermally conductively and releasably connected to the carrier (4).