Patents by Inventor Stephan Spichtinger

Stephan Spichtinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical examination device and optical examination method with visible and infrared light for semiconductor components
    Patent number: 11099134
    Abstract: An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 24, 2021
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Uladimir Prakapenka, Stephan Spichtinger, Rainer Miehlich
  • OPTICAL EXAMINATION DEVICE AND OPTICAL EXAMINATION METHOD WITH VISIBLE AND INFRARED LIGHT FOR SEMICONDUCTOR COMPONENTS
    Publication number: 20210010944
    Abstract: An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.
    Type: Application
    Filed: September 19, 2017
    Publication date: January 14, 2021
    Inventors: Uladimir Prakapenka, Stephan Spichtinger, Rainer Miehlich